MPF200TL-FCSG536E

The MPF200TL-FCSG536E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 192,000 logic elements and approximately 13.6 Mbits of embedded memory in a compact 536-LFBGA (536-CSPBGA, 16×16) surface-mount package.

With up to 300 I/O pins, a low-voltage supply range of 0.97 V to 1.08 V, and an extended operating temperature range of 0 °C to 100 °C, this device is suited to designs that require substantial programmable logic capacity, on-chip RAM, and high I/O density in a small form factor.

Key Features

• Core Capacity 192,000 logic elements to implement complex digital logic and custom processing pipelines.
• Embedded Memory Approximately 13.6 Mbits of on-chip RAM (total RAM bits: 13,619,200) for buffering, LUTs, and data storage.
• I/O Density Up to 300 I/O pins to support multiple interfaces and parallel connections.
• Power Supply Operates from a supply voltage range of 0.97 V to 1.08 V, enabling low-voltage system integration.
• Package and Mounting 536-LFBGA, CSPBGA footprint (supplier device package: 536-CSPBGA (16×16)); surface-mount for compact PCB designs.
• Temperature and Grade Extended grade with an operating temperature range of 0 °C to 100 °C for applications within that thermal envelope.

Typical Applications

• Custom digital processing — Implement signal processing, packet handling, or bespoke logic functions using 192,000 logic elements and on-chip RAM.
• High-density I/O interfaces — Connect multiple peripherals and parallel interfaces using the device’s 300 available I/O pins.
• Embedded system platforms — Use as the programmable logic foundation for embedded controllers and compute modules requiring substantial logic and memory resources.
• Prototype and development boards — Provide a compact, high-capacity FPGA option in 536-CSPBGA for evaluation and system prototyping.

Unique Advantages

• High logic capacity: 192,000 logic elements enable dense implementation of complex designs without external FPGA stitching.
• Significant on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path needs.
• Broad I/O capability: 300 I/O pins support multiple interfaces and simultaneous parallel connections, simplifying board-level routing.
• Compact surface-mount package: 536-CSPBGA (16×16) package balances high integration with a small PCB footprint.
• Low-voltage operation: Narrow supply range (0.97 V–1.08 V) for designs targeting low-voltage power domains.
• Extended temperature rating: Rated 0 °C to 100 °C for applications operating within that range.

Why Choose MPF200TL-FCSG536E?

The MPF200TL-FCSG536E positions itself as a high-capacity, compact PolarFire FPGA option that combines a large number of logic elements, substantial embedded memory, and extensive I/O in a 536-LFBGA surface-mount package. It is a fit for designers who need dense programmable logic and on-chip RAM without sacrificing PCB space.

Backed by Microchip Technology, this device supports designs that require scalability from prototype to production-level deployments within the specified voltage and temperature ranges, offering a balance of integration and performance for FPGA-based system implementations.

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