MPF200TL-FCG784I

The MPF200TL-FCG784I is a PolarFire™ FPGA from Microchip Technology designed for complex digital implementations. It provides a high logic element count combined with substantial embedded memory and a large I/O complement in a compact 784-FCBGA surface-mount package.

Targeted for industrial applications, the device delivers a combination of integration and environmental robustness, with an industrial operating temperature range and RoHS compliance for modern assembly processes.

Key Features

• Core / Logic Density   Provides 192,000 logic elements for implementing complex digital functions and large-scale FPGA designs.
• Embedded Memory   Includes approximately 13.6 Mbits of on-chip RAM for buffering, lookup tables and state storage without relying solely on external memory.
• I/O and Package   Features 364 I/Os in a 784-FCBGA (29×29) surface-mount package, enabling high-density connectivity in a compact footprint.
• Power   Core supply operates within a 0.97 V to 1.08 V window to meet platform power requirements.
• Temperature and Grade   Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance   RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• Industrial Control and Automation   High logic density and industrial temperature rating make the device suitable for control logic, PLCs and factory automation subsystems.
• Communications and Networking   Large I/O count and on-chip memory support protocol handling, packet buffering and interface logic in networking equipment.
• Embedded System Acceleration   Programmable fabric with substantial logic and memory for hardware acceleration and custom datapath implementations.
• I/O-Intensive Interface Bridging   High pin count in a compact FCBGA package enables board-level protocol conversion and multi-channel interfacing without excessive external multiplexing.

Unique Advantages

• High Logic Capacity: 192,000 logic elements support complex finite-state machines, custom accelerators and large FPGA designs.
• Substantial On-Chip Memory: Approximately 13.6 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Compact, High-Density I/O: 364 I/Os in a 784-FCBGA (29×29) surface-mount package enable dense connectivity while conserving board area.
• Industrial Robustness: Rated for −40 °C to 100 °C and supplied in an industrial-grade offering for deployment in harsh environments.
• Tight Core Voltage Range: 0.97–1.08 V supply range supports precise core power management.
• RoHS Compliant: Suitable for lead-free assembly and modern manufacturing workflows.

Why Choose MPF200TL-FCG784I?

The MPF200TL-FCG784I balances high logic density, meaningful on-chip memory and a high I/O count in a compact 784-FCBGA package, making it well suited for engineers designing industrial and embedded systems that require programmable flexibility and robust environmental performance. Backed by Microchip Technology, the device fits designs that need scalable logic resources, substantial embedded RAM and industrial-grade temperature tolerance.

Request a quote or submit a pricing inquiry to evaluate MPF200TL-FCG784I for your next FPGA-based design. Sales and quoting teams can provide availability and ordering information.