MPF200TL-FCG484E

The MPF200TL-FCG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers high-density programmable logic with substantial on-chip memory and I/O capacity in a compact BFBGA package.

Designed for designs that require large amounts of programmable logic and embedded memory, this device combines 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 244 I/Os in a 484-BFBGA surface-mount package. It operates from a core supply of 0.97 V to 1.08 V and is offered in an extended temperature grade.

Key Features

• Core Logic Capacity 192,000 logic elements provide high-density programmable logic resources for complex FPGA designs.
• Embedded Memory Approximately 13.6 Mbits of on-chip RAM to support data buffering, packet processing, and local storage needs.
• I/O Resources 244 I/Os enable extensive interfacing options for peripheral connectivity and multi-channel designs.
• Power Core voltage supply range of 970 mV to 1.08 V to match low-voltage FPGA power domains.
• Package & Mounting 484-BFBGA package (supplier device package 484-FPBGA, 19 × 19) with surface-mount construction for compact board integration.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for robust commercial and extended-environment applications.
• Environmental Compliance RoHS-compliant for use in lead-free assembly processes.

Typical Applications

• High-density programmable logic systems — Use the device where substantial logic resources and embedded memory are required for custom processing and control functions.
• Multi-I/O control and interface hubs — Leverage 244 I/Os to consolidate peripheral interfaces and reduce external glue logic.
• Compact, board-level FPGA implementations — The 484-BFBGA surface-mount package supports dense PCB layouts where space is at a premium.

Unique Advantages

• High logic capacity: 192,000 logic elements enable implementation of complex algorithms and wide parallelism without partitioning across multiple devices.
• Significant on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• Extensive I/O count: 244 I/Os simplify system integration by enabling numerous direct connections to peripherals and buses.
• Compact BFBGA package: 484-ball footprint provides a dense, board-friendly form factor for high-performance designs.
• Low-voltage core operation: Core supply range of 0.97 V to 1.08 V supports modern low-power power domains.
• Extended-grade rating: Rated for 0 °C to 100 °C operation to meet a wider range of environmental conditions.

Why Choose MPF200TL-FCG484E?

The MPF200TL-FCG484E positions itself as a high-density, feature-rich FPGA option for designs that need extensive logic resources, substantial embedded memory, and many I/Os in a compact package. Its combination of 192,000 logic elements, approximately 13.6 Mbits of on-chip RAM, and 244 I/Os offers designers the integration needed to consolidate functions and reduce board-level complexity.

Manufactured by Microchip Technology and supplied in a 484-BFBGA surface-mount package with extended temperature grading and RoHS compliance, this device is suited to long-life designs that prioritize density, integration, and predictable operating characteristics.

Request a quote or submit an inquiry to purchase the MPF200TL-FCG484E and evaluate its fit for your next high-density FPGA design.