MPF200T-FCSG536T2

The MPF200T-FCSG536T2 is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology designed for embedded and automotive applications. It delivers a high logic element count and sizable embedded memory in a compact 536-LFBGA package for designs that require dense logic, substantial on-chip RAM and a wide operating temperature range.

This device is AEC-Q100 qualified and rated for operation from −40 °C to 125 °C, making it suitable for automotive environments while providing a low-voltage core supply range for modern power-sensitive designs.

Key Features

• Core Capacity — 192,000 logic elements to implement complex custom logic and system functions within a single FPGA device.
• Logic Structure — Architecture detail reported as 48,000 CLBs (configurable logic blocks), enabling structured logic partitioning and implementation.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support large buffers, FIFOs and local data storage without external memory.
• I/O Density — 300 user I/O pins, providing broad connectivity for sensors, peripherals and high-pin-count interfaces.
• Power Supply — Core voltage range of 0.97 V to 1.08 V to match modern low-voltage system domains.
• Automotive Qualification & Temperature Range — AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive-grade deployment.
• Package & Mounting — Supplied in a 536-LFBGA (536-BGA, 16×16) surface-mount package for high-density board designs.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Automotive Electronic Systems — AEC-Q100 qualification and −40 °C to 125 °C rating enable use in vehicle subsystems where ambient extremes and reliability matter.
• Embedded Control and Signal Processing — High logic capacity and substantial on-chip RAM support complex control algorithms, real-time processing and buffering without immediate reliance on external memory.
• Interface Bridging and High-Density I/O — 300 I/O pins accommodate multiple peripheral interfaces, sensor arrays and communications endpoints in compact electronics.

Unique Advantages

• High logic density: 192,000 logic elements provide the headroom to integrate multiple functional blocks and reduce board-level component count.
• Significant on-chip memory: Approximately 13.95 Mbits of embedded RAM minimizes dependency on external memory for buffering and intermediate storage.
• Automotive-ready thermal performance: AEC-Q100 qualification combined with a −40 °C to 125 °C operating range supports deployment in harsh temperature environments.
• Compact, high-pin-count package: 536-LFBGA (536-BGA, 16×16) surface-mount package delivers high I/O capability in a space-efficient footprint.
• Low-voltage core operation: Core supply range of 0.97–1.08 V aligns with modern low-voltage system designs to help manage power budgets.
• RoHS compliant: Meets common environmental and sourcing requirements for commercial and automotive programs.

Why Choose MPF200T-FCSG536T2?

The MPF200T-FCSG536T2 combines a large logic element count, substantial embedded RAM and a high I/O count within a compact 536-LFBGA package, making it well suited for automotive and embedded designs that demand integration and thermal robustness. Its AEC-Q100 qualification and extended operating temperature range align the device to applications where environmental resilience is required.

This FPGA is appropriate for designers targeting high-density logic integration and on-chip memory capacity while maintaining a low-voltage core profile. For projects that require scalable logic resources, dependable thermal performance and a high pin-count interface, the MPF200T-FCSG536T2 provides a specification-driven foundation.

Request a quote or submit an inquiry to receive pricing and availability for the MPF200T-FCSG536T2 and to discuss how this PolarFire FPGA can fit your design requirements.