MPF200T-FCSG325T2

The MPF200T-FCSG325T2 is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology, supplied in a 325-TFBGA (325-BGA, 11×11) surface-mount package. It delivers a high density of programmable logic and embedded memory with 192,000 logic elements and approximately 13.95 Mbits of on-chip RAM, combined with 170 user I/O pins.

Designed for applications that require high logic capacity, substantial embedded memory, and robust environmental performance, this device supports a supply voltage range of 0.970 V to 1.08 V and an operating temperature range of −40 °C to 125 °C. It is qualified to AEC‑Q100 for automotive use and is RoHS compliant.

Key Features

• Logic Capacity — 192,000 logic elements provide substantial programmable resources for complex custom logic and hardware acceleration.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support data buffering, local storage, and intermediate processing.
• I/O Count — 170 user I/O pins suitable for multi-channel interfaces, sensor connections, and peripheral bridging.
• Power Supply — Operates from 0.970 V to 1.08 V, enabling designs targeting this core-voltage range.
• Package & Mounting — 325-TFBGA (325-BGA, 11×11) surface-mount package for compact board-level integration.
• Automotive Qualification & Reliability — AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive and harsh-environment deployment.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Automotive control systems — Use the AEC‑Q100 qualification, extended temperature range, and numerous I/Os to implement control, monitoring, and interfacing functions in automotive electronics.
• Embedded compute and acceleration — Leverage 192,000 logic elements and on-chip RAM for custom processing blocks and hardware acceleration within embedded systems.
• High-density I/O bridging — 170 I/O pins in a compact 325-TFBGA package enable protocol translation, multiplexing, and peripheral aggregation on space-constrained boards.
• Rugged embedded applications — Wide operating temperature and automotive qualification make the device suitable for embedded applications exposed to harsh thermal environments.

Unique Advantages

• High logic density: 192,000 logic elements deliver the capacity needed for complex custom logic without external gates.
• Significant on-chip memory: Approximately 13.95 Mbits of embedded RAM reduces dependency on external memory for many designs.
• Automotive-grade qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range support automotive deployment requirements.
• Compact surface-mount package: 325-TFBGA (11×11) enables high-density board integration while providing 170 I/O connections.
• Tight core-voltage range: Specification of 0.970 V to 1.08 V allows precise power delivery planning for core domains.
• RoHS compliant: Meets common environmental requirements for electronic products.

Why Choose MPF200T-FCSG325T2?

The MPF200T-FCSG325T2 positions itself where high programmable logic capacity, substantial embedded memory, and robust environmental qualifications are required. With 192,000 logic elements, approximately 13.95 Mbits of RAM, and 170 I/O in a compact 325-TFBGA package, it addresses designs that need density and I/O capability within constrained board space.

Its AEC‑Q100 qualification, wide operating temperature range, and RoHS compliance make it a suitable choice for automotive and other demanding embedded applications that require verified environmental performance and long-term reliability.

Request a quote or contact sales to discuss pricing, availability, and design support for MPF200T-FCSG325T2.