MPF200T-FCSG325E

The MPF200T-FCSG325E is a PolarFire™ FPGA from Microchip Technology configured in a 325-ball LFBGA package. It provides a high-density programmable logic fabric with 192,000 logic elements and approximately 13.6 Mbits of embedded memory, alongside 170 user I/Os.

Designed for surface-mount deployment with an extended-grade operating range and a core voltage supply of 0.97–1.08 V, this device suits designs that require substantial on-chip logic and memory integration in a compact FCBGA footprint.

Key Features

• Logic Capacity  192,000 logic elements provide substantial programmable logic resources for complex digital designs and hardware acceleration tasks.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM supports buffering, lookup tables, and data storage close to logic to reduce external memory dependence.
• I/O Resources  170 user I/Os enable a wide range of external interfaces and system connectivity without additional I/O expanders.
• Power Supply  Core operating voltage range from 0.97 V to 1.08 V allows designers to target the specified core supply window for device operation.
• Package & Mounting  325-LFBGA (supplier package: 325-FCBGA, 11 × 14.5 mm) in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade  Extended-grade device rated for operation from 0 °C to 100 °C to support a variety of deployment environments.
• Compliance  RoHS compliant, meeting common environmental directive requirements for lead-free assembly.

Typical Applications

• FPGA-based System Prototyping  Use the device’s large logic and memory resources to validate complex digital designs and accelerate development cycles.
• Custom Logic and Control  Implement control engines, custom state machines, and protocol handlers leveraging the device’s programmable fabric and abundant I/Os.
• Embedded Acceleration  Employ on-chip memory and logic elements to offload compute-intensive tasks and reduce external memory traffic.

Unique Advantages

• High Logic Density: 192,000 logic elements enable implementation of complex, large-scale designs without immediate need for multiple devices.
• Integrated Memory: Approximately 13.6 Mbits of embedded RAM allow substantial on-chip buffering and data handling, simplifying board-level memory requirements.
• Generous I/O Count: 170 user I/Os provide flexible external connectivity options for peripherals, sensors, and high-speed interfaces.
• Compact Package: 325-ball LFBGA/FCBGA footprint facilitates integration into space-constrained PCBs while maintaining a high pin count.
• Extended Operating Range: Rated for 0 °C to 100 °C operation to meet a broad set of environmental deployment needs.
• RoHS Compliant: Supports lead-free assembly processes and environmental compliance requirements.

Why Choose MPF200T-FCSG325E?

The MPF200T-FCSG325E positions itself as a high-capacity PolarFire FPGA option that balances extensive logic and memory resources with a compact BGA package and a robust I/O complement. It is well suited to engineers who need substantial on-chip resources for complex digital designs while maintaining board space efficiency and compliance with RoHS.

For design teams targeting scalable, reliable FPGA integration with clear electrical and environmental parameters—such as the core voltage window of 0.97–1.08 V and 0 °C to 100 °C operating range—this device offers a coherent platform backed by Microchip Technology’s PolarFire family specifications.

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