MPF200T-FCG784E

The MPF200T-FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology packaged in a 784-FCBGA (29×29) surface-mount package. It integrates a large logic fabric with significant embedded memory and a broad I/O count to support complex, configurable digital designs.

Key on-chip resources include 192,000 logic elements and approximately 13.6 Mbits of embedded memory, with a supply voltage range of 970 mV to 1.08 V and an operating temperature range of 0 °C to 100 °C. The device is offered in an Extended grade and is RoHS compliant.

Key Features

• Core Logic  Provides 192,000 logic elements for implementing large-scale digital designs and custom logic functions.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive functions.
• I/O Connectivity  364 available I/Os to interface with peripherals, memory, and external systems.
• Power Supply  Operates from a core voltage supply between 970 mV and 1.08 V to match system power domains.
• Package & Mounting  784-FCBGA (29×29) package in a 784-BBGA/FCBGA footprint, designed for surface-mount assembly.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant for regulatory and assembly considerations.

Typical Applications

• FPGA-based system designs  Used where large programmable logic capacity and substantial embedded memory are required to implement custom digital functions.
• High-density I/O interfacing  Suitable for designs needing hundreds of I/Os to connect multiple peripherals, sensors, or external memory devices.
• Embedded memory–centric logic  Applicable where on-chip RAM (approximately 13.6 Mbits) is needed for buffering, packet handling, or local data storage.

Unique Advantages

• Significant logic capacity: 192,000 logic elements enable complex, large-scale implementations without external programmable logic.
• Substantial embedded memory: Approximately 13.6 Mbits of on-chip RAM reduces dependence on external memory for many architectures.
• High I/O count: 364 I/Os provide flexible interfacing options for multi-channel and multi-peripheral designs.
• Compact FCBGA packaging: 784-FCBGA (29×29) balances high integration density with surface-mount assembly processes.
• Extended-grade operating range: Rated for 0 °C to 100 °C to meet a range of temperature environments where extended-grade parts are required.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose MPF200T-FCG784E?

The MPF200T-FCG784E positions itself as a high-capacity PolarFire™ FPGA option for designs that demand extensive programmable logic, on-chip memory, and a large number of I/Os in a compact FCBGA package. Its defined supply voltage range and extended-grade temperature rating make it straightforward to integrate into systems with established power and thermal constraints.

Engineers and procurement teams seeking a RoHS-compliant FPGA with clear, verifiable resource counts—192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 364 I/Os—will find this device suitable for complex, configurable digital designs where integration density and known operating limits are priorities.

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