MPF200T-FCG484T2

The MPF200T-FCG484T2 is a PolarFire™ field programmable gate array designed for applications that require high logic density and substantial on-chip memory. As an FPGA device, it provides a large programmable fabric with abundant I/O and embedded memory to support complex logic, buffering, and custom digital functions.

Qualified to AEC‑Q100 and specified for operation from ‑40 °C to 125 °C, this device targets automotive and other temperature-demanding applications that require robust, high-capacity programmable logic in a compact 484‑BGA package.

Key Features

• Core Logic Capacity — 192000 logic elements to implement complex digital designs and large-scale programmable functions.
• Embedded Memory — Approximately 13.95 Mbits of on‑chip RAM (13,946,061 bits) for data buffering, state storage, and memory-intensive logic.
• I/O Count — 244 user I/O pins to support multiple interfaces, parallel buses, and high-pin-count board designs.
• Package & Mounting — 484‑BGA package (484‑FPBGA, 23×23) with surface‑mount assembly for compact board integration.
• Supply Voltage — Core voltage range of 970 mV to 1.08 V to match system power domains.
• Temperature & Qualification — Rated for ‑40 °C to 125 °C and AEC‑Q100 qualified; suitable for automotive-grade deployments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Automotive Control Systems — AEC‑Q100 qualification and wide operating temperature range make the device suitable for vehicle electronics requiring programmable logic and on‑chip memory.
• High‑Density Embedded Systems — Large logic element count and substantial embedded RAM support complex signal processing, control logic, and state machines.
• I/O‑Rich Board Designs — 244 I/O pins enable multi‑interface designs, parallel connectivity, and signal routing in space‑constrained PCBs.

Unique Advantages

• Substantial Logic Resources: 192000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system complexity.
• Significant On‑Chip Memory: Approximately 13.95 Mbits of embedded RAM supports buffering and data‑intensive logic without external memory.
• Automotive‑Grade Reliability: AEC‑Q100 qualification and a ‑40 °C to 125 °C operating range enable deployment in temperature‑challenging automotive environments.
• Compact, Board‑Ready Package: 484‑BGA (23×23) surface‑mount package offers a balance of pin density and PCB footprint for high‑performance designs.
• Regulatory Compliance: RoHS compliance simplifies integration into manufacturable, environmentally compliant products.

Why Choose MPF200T-FCG484T2?

The MPF200T-FCG484T2 brings a combination of high logic capacity, significant embedded memory, and extensive I/O in a compact 484‑BGA package, positioning it for demanding embedded and automotive applications. Its AEC‑Q100 qualification and wide temperature rating provide design assurance for systems exposed to harsh thermal environments.

This device is well suited to engineers and program managers building robust, high‑functionality systems that require programmable flexibility, on‑chip memory resources, and automotive‑grade qualification. Its specification set supports scalable designs and long‑term reliability where both density and environmental performance matter.

Request a quote or submit an inquiry to receive pricing and availability for the MPF200T-FCG484T2 and to discuss how this device can fit your next design.