MPF200T-1FCVG484I

The MPF200T-1FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC supplied in a 484-BFBGA package. It provides a high-density programmable logic fabric with on-chip embedded memory and a broad set of I/O for system integration.

Designed for industrial-grade applications, the device combines 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 284 user I/Os while operating over a wide temperature range and a low core voltage window.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex programmable logic, datapaths, and control functions.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffers, FIFOs, and state storage without external memory dependencies.
• I/O Density — 284 user I/Os to connect to peripherals, sensors, and system interfaces.
• Power Supply — Core voltage range from 970 mV to 1.08 V to match low-voltage system domains.
• Package & Mounting — 484-BFBGA package (supplier device package: 484-FPBGA, 19×19) with surface-mount assembly for compact board designs.
• Operating Temperature — Industrial temperature rating from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Industrial Control — Implement complex control logic, sensor aggregation, and timing-critical functions using high logic density and ample on-chip RAM.
• Communications Equipment — Support protocol processing and interface bridging with plentiful I/O and embedded memory for packet buffering.
• Test & Measurement — Configure flexible data-paths and real-time signal processing functions while operating across industrial temperature ranges.

Unique Advantages

• High logic integration: 192,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM.
• Significant on-chip memory: Approximately 13.6 Mbits of embedded RAM supports buffering and state retention without external memory chips.
• Ample I/O count: 284 user I/Os simplify connectivity to peripherals and improve design flexibility for mixed-signal and digital systems.
• Industrial temperature capability: −40 °C to 100 °C operation increases deployment options for harsh or uncontrolled environments.
• Compact BGA packaging: 484-BFBGA (484-FPBGA, 19×19) surface-mount package supports high-density board layouts while maintaining robust mechanical performance.
• Low-voltage core operation: 970 mV to 1.08 V core supply range aligns with modern low-power system domains.

Why Choose MPF200T-1FCVG484I?

The MPF200T-1FCVG484I positions itself as a high-density, industrial-grade FPGA option for designs that require substantial programmable logic, embedded memory, and flexible I/O in a compact BGA package. Its combination of 192,000 logic elements, approximately 13.6 Mbits of on-chip RAM, and 284 I/Os makes it suitable for consolidating multiple functions and reducing external component count.

Selections that prioritize long-term robustness, temperature range, and RoHS compliance will find this device aligned with demanding industrial applications. The device is well suited for engineering teams targeting scalable, reliable FPGA-based implementations that need significant on-chip resources and board-level integration.

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