MPF200T-1FCSG536T2

The MPF200T-1FCSG536T2 is a PolarFire™ FPGA IC from Microchip Technology offering 192,000 logic elements, approximately 13.95 Mbits of embedded RAM, and 300 I/Os in a 536-LFBGA package. Its specifications address designs that require dense programmable logic, substantial on-chip memory, and a compact ball-grid package footprint.

Qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C with a core supply range of 0.970 V to 1.080 V, this device is positioned for applications demanding high logic capacity and extended temperature operation.

Key Features

• Logic resources — 192,000 logic elements to implement large-scale custom logic, datapath, and control functions.
• Embedded memory — Approximately 13.95 Mbits of on-chip RAM for buffering, state storage, and local data processing without external memory.
• I/O and package — 300 available I/Os in a 536-LFBGA (536‑BGA, 16×16) package to support dense interfacing and board-level integration.
• Power — Core supply range of 0.970 V to 1.080 V to match low-voltage system architectures.
• Automotive qualification and temperature — AEC‑Q100 qualified and rated for −40 °C to 125 °C operation for designs that require automotive-grade qualification and wide temperature margins.
• Mounting and compliance — Surface-mount 536-LFBGA package with RoHS compliance for modern PCB assembly and environmental standards.

Typical Applications

• Automotive systems — Suited for designs that require AEC‑Q100 qualification and extended temperature operation, enabling integration into automotive electronic modules.
• High-density I/O designs — 300 I/Os allow interfacing with multiple peripherals, sensors, and external devices on constrained PCB layouts.
• Large custom-logic implementations — 192,000 logic elements provide capacity for complex state machines, protocol processing, and custom accelerators.
• On-chip data buffering and local processing — Approximately 13.95 Mbits of embedded RAM supports on-device buffering and local data handling to reduce external memory dependency.

Unique Advantages

• High logic capacity: 192,000 logic elements enable implementation of substantial programmable logic without partitioning across multiple devices.
• Considerable on-chip memory: Approximately 13.95 Mbits of embedded RAM reduces the need for external memory and simplifies board design.
• AEC‑Q100 qualification: Enables use in automotive-grade projects requiring formal qualification and extended-temperature operation.
• Compact BGA package with extensive I/O: 536-LFBGA (16×16) delivers 300 I/Os in a compact surface-mount form factor for dense system integration.
• Low-voltage core support: Core supply range of 0.970 V–1.080 V aligns with modern low-voltage power domains to support efficient power architecture design.

Why Choose MPF200T-1FCSG536T2?

The MPF200T-1FCSG536T2 combines high logic density, substantial embedded memory, and a wide operating temperature range in a compact 536-LFBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C rating make it appropriate for designs that require automotive-level qualification alongside high-capacity programmable logic.

Designed by Microchip Technology, this PolarFire FPGA variant is suited to engineers and procurement teams building systems that need integrated logic, local memory, and robust temperature performance while maintaining a compact board footprint and extensive I/O capability.

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