MPF200T-1FCSG536E

IC FPGA 300 I/O 536CSPBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 300 13619200 192000 536-LFBGA, CSPBGA

Quantity 1,568 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package536-CSPBGA (16x16)GradeExtendedOperating Temperature0°C – 100°C
Package / Case536-LFBGA, CSPBGANumber of I/O300Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs48000Number of Logic Elements/Cells192000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13619200

Overview of MPF200T-1FCSG536E – PolarFire FPGA: 192,000 logic elements, approximately 13.6 Mbits RAM, 300 I/O

The MPF200T-1FCSG536E is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering a combination of dense programmable logic, embedded memory, and a high I/O count in a compact BGA package. It targets designers who need a configurable hardware platform with substantial logic capacity and on-chip RAM while meeting extended-grade temperature requirements.

Key Features

  • Core Logic 48,000 CLBs providing access to 192,000 logic elements to implement complex, custom digital functions.
  • Embedded Memory Approximately 13.6 Mbits of total on-chip RAM for buffering, data storage, and state machines.
  • I/O Capacity 300 user I/O pins to support broad interfacing options and multiple parallel interfaces.
  • Power Supply Operates from a supply range of 0.970 V to 1.08 V, enabling stable core operation within the specified voltage window.
  • Package & Mounting Available in a 536-LFBGA / 536-CSPBGA (16×16) package, designed for surface-mount PCB assembly.
  • Temperature & Grade Extended-grade device rated for 0 °C to 100 °C operating temperature to support a range of deployment environments.
  • RoHS Compliant Conforms to RoHS environmental requirements for lead-free manufacturing and material compliance.

Typical Applications

  • Custom Digital Processing — Implement application-specific datapaths and control logic using the device’s large logic and embedded memory resources.
  • High-Density I/O Systems — Leverage 300 I/O pins for multi-channel interfaces, parallel buses, or mixed-signal front-ends requiring significant GPIO.
  • Compact Board Designs — The 536-LFBGA / CSPBGA package and surface-mount mounting suit compact PCBs where board space and package density are important.

Unique Advantages

  • High Configurable Logic Capacity: 192,000 logic elements and 48,000 CLBs enable integration of large custom functions onto a single FPGA, reducing the need for multiple devices.
  • Substantial On-Chip RAM: Approximately 13.6 Mbits of embedded memory supports buffering and stateful processing without external memory in many designs.
  • Generous I/O Count: 300 I/O pins offer flexibility to support multiple interfaces and parallel connections, simplifying system integration.
  • Compact BGA Packaging: The 536-CSPBGA (16×16) package provides a high-pin-count solution in a compact footprint for space-constrained applications.
  • Extended Operating Range: Rated for 0 °C to 100 °C operation to meet a variety of environmental deployment conditions.
  • Regulatory-Friendly Material Compliance: RoHS compliance supports incorporation into lead-free manufacturing processes.

Why Choose MPF200T-1FCSG536E?

The MPF200T-1FCSG536E positions itself as a versatile PolarFire FPGA option for designers needing a balance of large logic capacity, meaningful embedded memory, and extensive I/O in a compact BGA package. Its electrical and thermal characteristics make it suitable for projects that require dense programmable logic and reliable operation across a typical commercial-to-extended temperature range.

This device is well suited to customers building complex digital systems where integration, PCB area efficiency, and on-chip memory are priorities. Its combination of logic, memory, and I/O helps reduce system BOM and simplifies board-level partitioning while keeping designs within defined voltage and temperature envelopes.

Request a quote or submit an inquiry for MPF200T-1FCSG536E to discuss availability, pricing, and lead times tailored to your project needs.

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