MPF200T-1FCSG536E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 300 13619200 192000 536-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,568 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 536-CSPBGA (16x16) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 536-LFBGA, CSPBGA | Number of I/O | 300 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 48000 | Number of Logic Elements/Cells | 192000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13619200 |
Overview of MPF200T-1FCSG536E – PolarFire FPGA: 192,000 logic elements, approximately 13.6 Mbits RAM, 300 I/O
The MPF200T-1FCSG536E is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering a combination of dense programmable logic, embedded memory, and a high I/O count in a compact BGA package. It targets designers who need a configurable hardware platform with substantial logic capacity and on-chip RAM while meeting extended-grade temperature requirements.
Key Features
- Core Logic 48,000 CLBs providing access to 192,000 logic elements to implement complex, custom digital functions.
- Embedded Memory Approximately 13.6 Mbits of total on-chip RAM for buffering, data storage, and state machines.
- I/O Capacity 300 user I/O pins to support broad interfacing options and multiple parallel interfaces.
- Power Supply Operates from a supply range of 0.970 V to 1.08 V, enabling stable core operation within the specified voltage window.
- Package & Mounting Available in a 536-LFBGA / 536-CSPBGA (16×16) package, designed for surface-mount PCB assembly.
- Temperature & Grade Extended-grade device rated for 0 °C to 100 °C operating temperature to support a range of deployment environments.
- RoHS Compliant Conforms to RoHS environmental requirements for lead-free manufacturing and material compliance.
Typical Applications
- Custom Digital Processing — Implement application-specific datapaths and control logic using the device’s large logic and embedded memory resources.
- High-Density I/O Systems — Leverage 300 I/O pins for multi-channel interfaces, parallel buses, or mixed-signal front-ends requiring significant GPIO.
- Compact Board Designs — The 536-LFBGA / CSPBGA package and surface-mount mounting suit compact PCBs where board space and package density are important.
Unique Advantages
- High Configurable Logic Capacity: 192,000 logic elements and 48,000 CLBs enable integration of large custom functions onto a single FPGA, reducing the need for multiple devices.
- Substantial On-Chip RAM: Approximately 13.6 Mbits of embedded memory supports buffering and stateful processing without external memory in many designs.
- Generous I/O Count: 300 I/O pins offer flexibility to support multiple interfaces and parallel connections, simplifying system integration.
- Compact BGA Packaging: The 536-CSPBGA (16×16) package provides a high-pin-count solution in a compact footprint for space-constrained applications.
- Extended Operating Range: Rated for 0 °C to 100 °C operation to meet a variety of environmental deployment conditions.
- Regulatory-Friendly Material Compliance: RoHS compliance supports incorporation into lead-free manufacturing processes.
Why Choose MPF200T-1FCSG536E?
The MPF200T-1FCSG536E positions itself as a versatile PolarFire FPGA option for designers needing a balance of large logic capacity, meaningful embedded memory, and extensive I/O in a compact BGA package. Its electrical and thermal characteristics make it suitable for projects that require dense programmable logic and reliable operation across a typical commercial-to-extended temperature range.
This device is well suited to customers building complex digital systems where integration, PCB area efficiency, and on-chip memory are priorities. Its combination of logic, memory, and I/O helps reduce system BOM and simplifies board-level partitioning while keeping designs within defined voltage and temperature envelopes.
Request a quote or submit an inquiry for MPF200T-1FCSG536E to discuss availability, pricing, and lead times tailored to your project needs.

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