MPF200T-1FCSG536I

The MPF200T-1FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density programmable fabric with 192,000 logic elements and approximately 13.6 Mbits of on-chip RAM, packaged in a compact 536-LFBGA (536-CSPBGA, 16×16) surface-mount package.

Designed for industrial-grade applications, the device supports up to 300 I/Os and operates across a supply range of 0.97 V to 1.08 V and an ambient temperature range of −40 °C to 100 °C, making it suitable for embedded systems that require substantial logic capacity and on-chip memory.

Key Features

• Logic Resources — 192,000 logic elements provide substantial programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffering, state storage, and local data processing without external memory.
• I/O Capability — Up to 300 general-purpose I/Os to interface with peripherals, sensors, and external devices.
• Power Supply — Core voltage support from 0.97 V to 1.08 V to match system power rails and enable stable operation within specified range.
• Package & Mounting — 536-LFBGA, CSPBGA (supplier package: 536-CSPBGA, 16×16) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Custom hardware acceleration — Use the 192,000 logic elements and embedded memory to implement application-specific accelerators and offload compute tasks from processors.
• High-density I/O aggregation — Leverage up to 300 I/Os for aggregating sensors, transceivers, and peripheral interfaces in compact systems.
• Embedded system integration — Combine programmable logic and on-chip RAM to handle data buffering, protocol bridging, and control tasks within industrial embedded designs.

Unique Advantages

• High logic density: 192,000 logic elements enable complex designs without immediate need for multiple devices, reducing board-level complexity.
• Sizable on-chip memory: Approximately 13.6 Mbits of RAM supports local data storage and reduces reliance on external memory components.
• Flexible I/O: 300 available I/Os accommodate diverse peripheral and interface requirements on a single device.
• Compact, manufacturable package: 536-CSPBGA surface-mount package (16×16) supports dense PCBs and automated assembly processes.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
• RoHS compliant: Meets common environmental standards for material composition.

Why Choose MPF200T-1FCSG536I?

The MPF200T-1FCSG536I positions itself as a high-capacity, industrial-grade FPGA solution that balances logic density, embedded memory, and I/O flexibility in a compact surface-mount package. Its voltage and temperature specifications align with many embedded and industrial system requirements, allowing designers to consolidate logic and memory functions on a single device.

This part is appropriate for teams building systems that require substantial programmable logic resources, significant on-chip RAM, and a large number of I/Os within a robust industrial temperature window. Its combination of features supports scalable designs where integration and reliability are priorities.

Request a quote or submit a pricing inquiry for MPF200T-1FCSG536I to receive availability and lead-time details tailored to your project requirements.