MPF200T-1FCSG325T2

The MPF200T-1FCSG325T2 is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a large amount of programmable logic and embedded memory in a compact 325‑TFBGA package for demanding embedded and automotive applications.

With 192,000 logic elements, approximately 13.95 Mbits of on‑chip RAM and 170 I/O, this device targets designs that require substantial logic capacity and deterministic operating conditions, supported by AEC‑Q100 qualification and a wide operating temperature range.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex digital functions and parallel processing pipelines.
• Embedded Memory — Approximately 13.95 Mbits of on‑chip RAM for buffers, FIFOs and local data storage.
• I/O — 170 user I/O pins to support multiple interfaces and peripheral connections.
• Automotive Qualification — AEC‑Q100 qualification and Grade: Automotive for use in qualified automotive designs.
• Operating Range — Core voltage supply range of 970 mV to 1.08 V and an operating temperature range of −40 °C to 125 °C for robust environmental performance.
• Package and Mounting — 325‑TFBGA (supplier package: 325‑BGA, 11×11) in a surface‑mount form factor for space‑efficient board designs.
• Regulatory — RoHS compliant.

Typical Applications

• Automotive control systems — Use in automotive electronic modules where AEC‑Q100 qualification and the −40 °C to 125 °C temperature range are required.
• Embedded compute and control — Implement complex logic, state machines and protocol processing with high logic density and substantial on‑chip memory.
• Sensor and actuator interface — Aggregate and preprocess sensor data using available I/O and local RAM for deterministic control tasks.

Unique Advantages

• High logic density: 192,000 logic elements provide headroom for complex designs and future feature growth.
• Significant on‑chip memory: Approximately 13.95 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑path needs.
• Automotive‑grade qualification: AEC‑Q100 qualification supports use in automotive applications that require recognized component-level qualification.
• Wide thermal tolerance: −40 °C to 125 °C operating range supports deployment in harsh or variable environments.
• Compact, manufacturable package: 325‑TFBGA (11×11) surface‑mount package balances board area and routing density for production designs.
• Defined core supply range: Operates with a core voltage supply between 970 mV and 1.08 V to match system power architectures.

Why Choose MPF200T-1FCSG325T2?

The MPF200T-1FCSG325T2 positions itself as a high‑capacity, automotive‑qualified FPGA option from Microchip Technology. Its combination of 192,000 logic elements, approximately 13.95 Mbits of embedded memory, and 170 I/O in a compact 325‑TFBGA package delivers a balanced platform for complex embedded and automotive designs.

Design teams seeking a robust, qualified FPGA with substantial on‑chip resources will find this device suitable for projects that require long‑term reliability, thermal resilience, and generous logic and memory headroom.

Request a quote or submit an inquiry for pricing and availability to evaluate the MPF200T-1FCSG325T2 for your next design.