MPF200T-1FCG784E

The MPF200T-1FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-density programmable logic resource with substantial embedded memory and a large I/O count in a compact 784-ball FCBGA package.

Targeted at designs that require extensive programmable logic, on-chip memory, and significant external interfacing while operating in extended-temperature environments, this device delivers a balance of integration and thermal range suitable for a range of embedded applications.

Key Features

• Core Logic  Contains 192,000 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• I/O Capacity  364 I/O pins support broad external interfacing for peripherals, sensors, and high-pin-count designs.
• Power Supply  Core voltage range from 970 mV to 1.08 V to match system power-rail requirements.
• Package & Mounting  784-BBGA (784-FCBGA, 29 × 29) surface-mount package provides a dense footprint for space-constrained PCBs.
• Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Custom programmable logic  Implement user-defined digital logic and state machines using the device's 192,000 logic elements and embedded memory.
• I/O-intensive designs  Leverage up to 364 I/Os to connect multiple peripherals, interfaces, and external devices.
• Embedded systems with extended-temperature needs  Deploy in systems requiring operation across 0 °C to 100 °C using the extended-grade package.

Unique Advantages

• High logic capacity: 192,000 logic elements enable large-scale programmable logic implementations without external logic expansion.
• Substantial on-chip memory: Approximately 13.6 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Generous I/O count: 364 I/Os simplify board-level connectivity and reduce the need for additional I/O expanders.
• Compact, high-density package: 784-FCBGA (29 × 29) surface-mount package provides a space-efficient solution for high-pin-count requirements.
• Extended-temperature operation: Rated 0 °C to 100 °C and designated extended grade for deployment in thermally demanding environments.
• Low-voltage core operation: Core supply range of 0.97 V to 1.08 V supports designs targeting low-voltage power domains.

Why Choose MPF200T-1FCG784E?

The MPF200T-1FCG784E positions itself as a high-capacity PolarFire™ FPGA from Microchip Technology, combining large programmable logic resources, meaningful embedded memory, and a high I/O count in a compact FCBGA package. Its extended-grade rating and RoHS compliance make it suitable for embedded designs that require sustained operation across a defined temperature window and regulatory compliance.

Engineers looking for a scalable programmable-logic device with significant on-chip resources and dense board-level integration will find this part suited to designs that demand integration of logic, memory, and I/O within a surface-mount footprint.

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