MPF100TS-FCVG484I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 7782400 109000 484-BBGA, FCBGA |
|---|---|
| Quantity | 248 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 27250 | Number of Logic Elements/Cells | 109000 | ||
| Number of Gates | N/A | ECCN | 5A992C | HTS Code | 8542.31.0001 | ||
| Qualification | N/A | Total RAM Bits | 7782400 |
Overview of MPF100TS-FCVG484I – PolarFire™ FPGA, 109000 logic elements, 484-FCBGA, 284 I/Os
The MPF100TS-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a large on-chip logic capacity and embedded RAM in a compact 484-ball FCBGA package designed for industrial-grade applications.
With 109,000 logic elements, approximately 7.78 Mbits of embedded memory and 284 I/Os, this device targets designs that require substantial programmable logic, mid-density embedded memory, and broad I/O connectivity while operating across an extended temperature range.
Key Features
- Core Logic Capacity — 109,000 logic elements provide significant programmable logic resources for complex digital designs.
- Embedded Memory — Approximately 7.78 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
- I/O Density — 284 general-purpose I/Os to accommodate multiple interfaces, sensors, and peripherals directly on-chip.
- Package and Mounting — 484-ball FCBGA (484-BBGA) surface-mount package, supplier device package noted as 484-FCBGA (23×23) for compact board-level integration.
- Power Supply — Core voltage supply range from 0.970 V to 1.080 V, enabling defined power-domain design and sequencing.
- Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Environmental Compliance — RoHS compliant to support regulatory requirements for electronic assemblies.
Typical Applications
- Industrial Systems — Programmable logic for control and automation equipment that requires industrial-grade operation across −40 °C to 100 °C.
- Embedded Control and I/O Expansion — High I/O count (284 I/Os) and large logic capacity to implement custom I/O aggregation, protocol handling, and control functions.
- High-density Digital Designs — Combine 109,000 logic elements with approximately 7.78 Mbits of embedded memory for mid-density state machines, data buffering, and custom accelerators.
Unique Advantages
- High Logic Integration: 109,000 logic elements reduce the need for multiple discrete devices when implementing complex FPGA-based functions.
- Substantial On-chip Memory: Approximately 7.78 Mbits of embedded RAM supports local data storage and buffering to simplify external memory requirements.
- Generous I/O Count: 284 I/Os enable direct connection to multiple peripherals, sensors, and external subsystems without extensive external multiplexing.
- Industrial-grade Operation: Specified for −40 °C to 100 °C, providing a reliable choice for temperature-demanding installations.
- Compact Surface-mount FCBGA Package: 484-ball FCBGA (23×23) balances board density and thermal/mechanical integration for space-constrained systems.
- Regulatory Compatibility: RoHS compliance supports designs targeting markets with lead-free and restricted-substance requirements.
Why Choose MPF100TS-FCVG484I?
The MPF100TS-FCVG484I positions itself as a robust, industrial-grade FPGA option within the PolarFire™ family, offering a balance of large logic capacity, meaningful on-chip memory, and high I/O density in a compact FCBGA package. Its defined core voltage range and extended operating temperature make it suitable for systems that require deterministic power domains and operation in challenging thermal environments.
This device is well suited for engineers and system designers who need substantial programmable logic and embedded memory without sacrificing I/O flexibility, and who require an industrial temperature rating and RoHS compliance for their deployments.
Request a quote or submit a pricing inquiry for MPF100TS-FCVG484I to get current availability and lead-time information.

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