MPF200T-1FCG484E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 244 13619200 192000 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,467 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 244 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 48000 | Number of Logic Elements/Cells | 192000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13619200 |
Overview of MPF200T-1FCG484E – PolarFire™ FPGA, 192,000 logic elements, 244 I/Os, 484-FCBGA
The MPF200T-1FCG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for programmable digital logic integration. It provides a large logic capacity and on-chip memory in a compact surface-mount FCBGA package for deployment in a range of digital systems.
Its combination of logic resources, I/O density and extended-grade temperature support makes it suitable for applications requiring significant on-chip logic and memory capacity within a controlled temperature range.
Key Features
- Core Logic Capacity — Provides 192,000 logic elements and 48,000 logic blocks for implementing complex custom logic and datapaths.
- Embedded Memory — Approximately 13.62 Mbits of on-chip RAM to support buffering, lookup tables and state storage without external memory.
- I/O Density — 244 user I/Os to support multiple parallel interfaces, sensors, or external peripherals.
- Power Supply — Core supply operating range from 970 mV to 1.08 V for the device core domain.
- Package & Mounting — 484-FCBGA (23 × 23) package in a 484-BBGA/FCBGA form factor, designed for surface-mount PCB assembly.
- Temperature & Grade — Extended-grade device rated for operation from 0 °C to 100 °C, suitable for deployments within this temperature envelope.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Embedded Systems — Implement custom control logic, peripheral aggregation and application-specific accelerators using on-chip logic and memory.
- Communications and Networking — Aggregate interfaces and implement protocol handling where significant I/O count and programmable logic are required.
- Industrial Control — Integrate digital control, data buffering and interface logic within an extended-grade temperature range.
- Test & Measurement — Create customizable data acquisition front-ends and processing pipelines using abundant logic resources and embedded RAM.
Unique Advantages
- High logic density: 192,000 logic elements enable large-scale designs and complex finite-state machines without multiple devices.
- Significant on-chip memory: Approximately 13.62 Mbits of embedded RAM reduces dependence on external memory for many buffering and lookup needs.
- Generous I/O count: 244 I/Os support diverse external interfaces and parallel connections directly to the FPGA fabric.
- Compact surface-mount package: 484-FCBGA (23×23) packaging provides a high-density form factor for space-constrained PCBs.
- Controlled temperature range: Extended-grade rating and 0 °C to 100 °C operating range align the device with deployments that operate within these bounds.
- Regulatory readiness: RoHS compliance supports integration into designs targeting current environmental requirements.
Why Choose MPF200T-1FCG484E?
The MPF200T-1FCG484E positions a large-capacity PolarFire FPGA in a compact FCBGA package, delivering substantial logic resources, embedded memory and a high I/O count for demanding programmable logic tasks. Its extended-grade rating and defined supply range allow designers to plan system power and thermal characteristics with confidence.
This device is well suited to teams building complex digital systems that require on-chip memory and numerous external interfaces, offering a scalable option where a single, integrated FPGA can reduce board-level complexity and part count.
Request a quote or submit an inquiry to obtain pricing, availability and additional technical guidance for integrating the MPF200T-1FCG484E into your design.

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