MPF200T-1FCG784I

The MPF200T-1FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a programmable logic fabric with 192,000 logic elements and on-chip embedded memory to implement complex, customized digital functions.

Designed for industrial-grade deployments, the device features 364 I/Os, approximately 13.62 Mbits of embedded memory, a 784-FCBGA (29×29) package, and a supply voltage range of 970 mV to 1.08 V, supporting designs that require substantial logic density, configurable I/O, and robust operating temperature capability.

Key Features

• Logic Capacity 192,000 logic elements providing substantial programmable fabric for implementation of custom logic, state machines, and signal processing pipelines.
• Embedded Memory Approximately 13.62 Mbits of on-chip RAM for buffering, FIFOs, and data path storage to support complex algorithms and packet handling.
• I/O 364 I/O pins to accommodate wide peripheral connectivity and multiple interface lanes directly from the FPGA package.
• Package and Mounting 784-FCBGA (29×29) package in a 784-BBGA form factor, surface-mount package suitable for compact board-level integration.
• Power Core supply voltage specified from 970 mV to 1.08 V to match system power-architecture requirements.
• Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant, meeting environmental regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Implement motion control, motor drive logic, and protocol bridging using the device’s large logic array and numerous I/Os within industrial temperature requirements.
• Communications Infrastructure Support packet buffering, custom framing, and parallel interface aggregation leveraging the embedded RAM and high I/O count.
• Data Acquisition and Instrumentation Aggregate sensor inputs and implement preprocessing pipelines using abundant logic elements and on-chip memory.

Unique Advantages

• Substantial Logic Density: 192,000 logic elements enable integration of multiple functions on a single device, reducing board-level component count.
• Significant Embedded Memory: Approximately 13.62 Mbits of RAM supports buffering, streaming, and temporary storage without external memory in many designs.
• High I/O Count: 364 I/Os provide flexibility for interfacing with a wide range of peripherals, sensors, and high-pin-count connectors.
• Industrial Temperature Capability: Specified operation from −40 °C to 100 °C supports deployment in harsher environments common to industrial systems.
• Compact, Surface-Mount Package: 784-FCBGA (29×29) package allows for dense PCB integration while maintaining robust electrical connections.
• Regulatory Compliance: RoHS compliance facilitates use in lead-free manufacturing processes.

Why Choose MPF200T-1FCG784I?

The MPF200T-1FCG784I positions itself as an industrial-grade FPGA offering a balance of high logic capacity, generous embedded memory, and substantial I/O in a compact FCBGA package. These characteristics make it well suited for engineers building configurable, board-level solutions that require on-chip resources and reliable operation across a broad temperature range.

For design teams targeting industrial control, communications, or instrumentation applications, the device provides a scalable and integrable platform with clear, verifiable specifications for logic, memory, I/O, power, and environmental operation backed by Microchip Technology.

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