MPF200T-1FCSG325I

The MPF200T-1FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade embedded logic applications. It delivers a high-density programmable fabric with substantial on-chip memory and a broad I/O count for system integration in industrial environments.

With 192,000 logic elements, approximately 13.6 Mbits of embedded memory and 170 I/Os in a 325-LFBGA package, this device targets designs that require mid-to-high FPGA resources, low-voltage operation, and extended operating temperature capability.

Key Features

• Logic Capacity — 192,000 logic elements provide extensive programmable logic for custom digital functions and control.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM to support buffering, state storage, and data processing without external memory.
• I/O Count — 170 available I/Os for flexible interfacing with peripherals, sensors, and external devices.
• Power — Core voltage supply range of 0.970 V to 1.08 V suitable for low-voltage FPGA operation.
• Package and Mounting — 325-LFBGA package (supplier device package: 325-FCBGA, 11 × 14.5 mm) with surface-mount mounting type for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet extended-temperature system requirements.
• Regulatory Compliance — RoHS compliant for environmental conformity.

Typical Applications

• Industrial control and automation — Implement custom control logic, deterministic timing, and interface aggregation in industrial equipment operating across extended temperature ranges.
• Embedded acceleration and protocol bridging — Offload application-specific processing and bridge diverse interfaces using the device’s logic capacity and abundant I/Os.
• Custom digital systems — Develop tailored state machines, signal processing pipelines, and control systems that benefit from on-chip memory and programmable logic.

Unique Advantages

• High-density programmable fabric: 192,000 logic elements enable complex logic implementation without immediate need for multiple devices.
• Significant on-chip RAM: Approximately 13.6 Mbits of embedded memory reduces reliance on external memory, simplifying BOM and board layout.
• Generous I/O resources: 170 I/Os offer flexible interfacing options, reducing the need for external IO expander components.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in harsh environments and industrial systems.
• Compact surface-mount package: 325-LFBGA (325-FCBGA, 11 × 14.5 mm) enables dense PCB integration for space-constrained designs.
• Low-voltage core operation: 0.970 V–1.08 V supply range aligns with modern, efficient system power architectures.

Why Choose MPF200T-1FCSG325I?

The MPF200T-1FCSG325I positions itself as a robust, industrial-grade FPGA option that balances logic density, on-chip memory, and I/O capacity for demanding embedded designs. Its specification set supports developers and system designers looking for scalable programmable logic in industrial environments where extended temperature range and compact packaging matter.

This PolarFire™ device is suited for customers building customized digital systems, protocol bridges, and embedded acceleration modules that require predictable, field-programmable capability and a compact board footprint. The combination of logic elements, embedded memory, and I/O resources offers long-term design flexibility and integration potential.

Request a quote or submit a procurement inquiry to receive pricing and availability for MPF200T-1FCSG325I.