MPF200T-1FCG484T2

The MPF200T-1FCG484T2 is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology. It provides a high logic-density FPGA in a compact 484‑BGA package and is specified for automotive use with AEC‑Q100 qualification and extended temperature operation.

With extensive embedded memory, a large I/O count, and a surface-mount 484‑FPBGA (23×23) package, this device targets applications that require dense programmable logic, robust I/O integration, and operation across automotive temperature ranges.

Key Features

• Logic Capacity  192,000 logic elements suitable for implementing complex FPGA designs and dense digital functions.
• Configurable Logic Blocks  48,000 CLB-style resources for structured logic partitioning and flexible design mapping.
• Embedded Memory  Approximately 13.95 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Integration  244 I/O pins to support multi-channel interfaces, sensor and actuator connections, and board-level integration.
• Package & Mounting  484‑BGA (supplier package: 484‑FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Power  Core voltage supply range of 0.970 V to 1.080 V to align with board power-rail designs.
• Qualification & Temperature  AEC‑Q100 qualification with an operating temperature range of −40 °C to 125 °C for automotive environments.
• Compliance  RoHS compliant.

Typical Applications

• Automotive systems  Suitable for vehicle electronics where AEC‑Q100 qualification and extended temperature range are required.
• High-density logic implementations  Use in designs that require substantial programmable logic resources and structured CLB capacity.
• Memory-intensive functions  Embedded memory supports buffering, lookup tables, and state retention for data-centric FPGA tasks.
• Board-level integration  244 I/O and a compact 484‑FPBGA (23×23) surface-mount package enable dense system interfaces on compact PCBs.

Unique Advantages

• Automotive-qualified component: AEC‑Q100 qualification and −40 °C to 125 °C operating range for automotive-grade deployment.
• High logic density: 192,000 logic elements provide capacity for complex algorithms and signal processing in a single device.
• Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM reduces dependence on external memory for many designs.
• Rich I/O count: 244 available I/O pins support multiple interfaces and parallel connections without extensive board-level multiplexing.
• Compact BGA packaging: 484‑FPBGA (23×23) surface-mount package enables space-efficient integration on modern automotive and embedded PCBs.
• Tightly specified core supply: 0.970 V to 1.080 V supply range allows precise power budgeting in system design.

Why Choose MPF200T-1FCG484T2?

The MPF200T-1FCG484T2 positions itself as a high-capacity PolarFire FPGA option for automotive and other applications demanding AEC‑Q100 qualification and extended temperature operation. Its combination of 192,000 logic elements, approximately 13.95 Mbits of embedded memory, and 244 I/O in a compact 484‑BGA package supports complex, memory-aware designs while simplifying board integration.

Backed by Microchip Technology, this device is suitable for designers and procurement teams seeking a qualified, high-density FPGA solution for long-term projects that require reliable operation across automotive temperature ranges.

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