MPF100TS-FCSG325I

The MPF100TS-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a combination of mid-to-high logic capacity and on-chip memory in a compact 325-pin FCBGA surface-mount package for industrial applications.

Key on-chip resources include approximately 109,000 logic elements, roughly 7.78 Mbits of embedded memory, and 170 I/O pins. The device operates from a core supply range of 0.97 V to 1.08 V and is specified for an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Capacity  Approximately 109,000 logic elements for implementing complex programmable logic and custom processing blocks.
• Embedded Memory  Approximately 7.78 Mbits of on-chip RAM for FIFOs, buffering, and state storage to support data-path and control logic.
• I/O and Package  170 user I/Os in a 325-LFBGA (FCBGA) surface-mount package (325-FCBGA, 11×11), simplifying board-level integration in compact designs.
• Power  Core voltage supply range of 0.97 V to 1.08 V to match system power rails and power management strategies.
• Industrial Temperature Grade  Specified operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Package & Mounting  Surface-mount 325-FCBGA package suitable for automated PCB assembly and dense system layouts.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Industrial Automation  Programmable logic and embedded memory support control, real-time processing, and sensor interfacing in industrial systems operating across wide temperature ranges.
• Communication Equipment  Logic capacity and I/O density enable protocol handling, custom packet processing, and interface bridging in networking and telecom gear.
• Embedded Signal Processing  On-chip RAM and abundant logic elements provide resources for data buffering, pipelines, and custom signal-processing blocks.

Unique Advantages

• High Logic Density: With approximately 109,000 logic elements, the device supports complex, custom digital designs without external programmable logic.
• Substantial On-Chip Memory: Approximately 7.78 Mbits of embedded RAM reduce external memory dependency for many buffering and stateful functions.
• Industrial-Grade Temperature Range: Specified from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact, Surface-Mount Package: 325-FCBGA (11×11) package balances I/O count and board-area efficiency for space-constrained systems.
• RoHS Compliant: Meets lead-free and environmental directives for modern manufacturing requirements.

Why Choose MPF100TS-FCSG325I?

The MPF100TS-FCSG325I combines substantial programmable logic and embedded memory with industrial temperature capability and a compact FCBGA package, making it suitable for designs that require significant on-chip resources in a surface-mount form factor. Its 170 I/Os and RoHS compliance help streamline integration into modern industrial and communications platforms.

This FPGA is a fit for engineers and procurement teams building robust, scalable systems where on-chip logic density, embedded RAM, and a wide operating temperature window are primary considerations. The Microchip PolarFire family attributes reflected in this device support long-term deployment and maintainable system designs.

Request a quote today to obtain pricing and availability for the MPF100TS-FCSG325I and to discuss how its specifications match your project requirements.