MPF100TS-1FCSG325I

The MPF100TS-1FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology, provided in a 325-pin LFBGA/FCBGA package. It delivers a large logic resource set and embedded memory in a surface-mount package designed for industrial-grade deployments.

With 109,000 logic elements, approximately 7.78 Mbits of embedded memory, and up to 170 I/Os, the device targets designs that require substantial on-chip logic, memory, and I/O capacity while operating over a wide industrial temperature range.

Key Features

• Core Logic  109,000 logic elements provide extensive programmable logic capacity for complex FPGA designs.
• Embedded Memory  Approximately 7.78 Mbits of on-chip RAM to support data buffering, state machines, and memory-intensive logic functions.
• I/O Count  Up to 170 general-purpose I/O pins to connect to external peripherals and subsystems.
• Power  Core voltage supply range from 970 mV to 1.08 V for the device core power domain.
• Package & Mounting  325-LFBGA / 325-FCBGA (11×11) surface-mount package providing a compact footprint for high-density board designs.
• Temperature & Grade  Industrial grade operation with an ambient operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS-compliant construction.

Typical Applications

• Industrial Control Systems  For industrial designs requiring an industrial-grade FPGA capable of operating from −40 °C to 100 °C while providing substantial logic and memory resources.
• High-Density I/O Designs  Suited to systems that need up to 170 I/Os in a compact 325-FCBGA (11×11) package for dense board integration.
• Memory-Intensive Logic  Appropriate where approximately 7.78 Mbits of embedded memory and extensive logic (109,000 logic elements) are required on-chip.

Unique Advantages

• High On-Chip Logic Capacity: 109,000 logic elements reduce the need for off-chip programmable logic, simplifying BOM and board complexity.
• Substantial Embedded Memory: Approximately 7.78 Mbits of RAM supports buffering and complex stateful processing within the FPGA fabric.
• Robust I/O Resource: Up to 170 I/Os enable flexible interfacing to a wide range of peripherals and external devices.
• Industrial Temperature Support: Rated for −40 °C to 100 °C to meet thermal requirements for industrial deployments.
• Compact, Surface-Mount Package: 325-LFBGA / 325-FCBGA (11×11) provides a balance of pin count and board space for high-density applications.
• Low-Voltage Core Operation: Core supply range of 970 mV to 1.08 V to align with modern FPGA power domains.

Why Choose MPF100TS-1FCSG325I?

The MPF100TS-1FCSG325I positions itself as an industrial-grade PolarFire FPGA solution combining a high logic element count with significant embedded memory and a large I/O complement in a compact 325-pin FCBGA package. These characteristics make it suitable for designers who need on-chip capacity for complex logic, substantial memory for data handling, and broad I/O connectivity while maintaining industrial temperature resilience.

Manufactured by Microchip Technology and supplied as a RoHS-compliant, surface-mount device, the MPF100TS-1FCSG325I offers a clear option for engineers seeking a scalable, reliable FPGA building block for industrial and high-density applications.

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