MPF100TLS-FCSG325I

The MPF100TLS-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC by Microchip Technology. It provides a reconfigurable logic fabric with a large logic capacity and embedded memory in an industrial-grade surface-mount package.

Designed for industrial and embedded applications, this device combines 109,000 logic elements, approximately 7.78 Mbits of embedded memory, and 170 I/Os to enable complex custom logic, interface bridging, and system integration within a compact 325-LFBGA footprint.

Key Features

• Logic Capacity — 109,000 logic elements to implement sizable FPGA designs and custom hardware functions.
• Embedded Memory — Approximately 7.78 Mbits of on-chip RAM for buffering, LUTs, and state storage.
• I/O Count — 170 user I/Os to support multiple peripherals, interfaces, and board-level routing requirements.
• Power Supply — Core operating voltage range from 970 mV to 1.08 V, matching low-voltage core power domains.
• Package — 325-LFBGA, FCBGA (11×11) supplier device package providing a high-density, surface-mount solution.
• Thermal and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting — Surface mount device suitable for modern PCB assembly processes.
• Compliance — RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Control and Automation — Use the device’s logic density and industrial temperature range to implement control algorithms, I/O aggregation, and custom protocol handling.
• Embedded System Integration — Deploy as a reconfigurable co-processor or glue-logic device to consolidate functions and reduce external components.
• High-Density I/O Bridging — Leverage 170 I/Os for board-level interface bridging, parallel sensor arrays, or multi-protocol connectivity.

Unique Advantages

• High Logic Density: 109,000 logic elements provide capacity for complex state machines, datapaths, and custom accelerators.
• Significant On-Chip Memory: Approximately 7.78 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Broad I/O Availability: 170 I/Os enable flexible system interfacing and consolidation of multiple signals without extra glue logic.
• Industrial Qualification: Rated for −40 °C to 100 °C operation to support deployment in harsh or temperature-variable environments.
• Compact, High-Density Package: 325-LFBGA (11×11) package balances board space efficiency with routing density for advanced PCBs.
• RoHS Compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose MPF100TLS-FCSG325I?

The MPF100TLS-FCSG325I positions itself as a robust, industrial-grade FPGA solution for designs that require substantial logic resources, embedded memory, and a high number of I/Os in a compact surface-mount package. Its specified operating temperature range and RoHS compliance make it suitable for long-life industrial and embedded deployments.

This device is appropriate for engineers and procurement teams seeking a Microchip Technology PolarFire FPGA with a balance of logic capacity, on-chip RAM, and interfacing capability—delivering scalability and integration for complex board-level designs.

Request a quote or submit an inquiry to begin procurement of the MPF100TLS-FCSG325I for your next project.