MPF100TL-FCVG484E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 7782400 109000 484-BFBGA |
|---|---|
| Quantity | 1,571 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 27250 | Number of Logic Elements/Cells | 109000 | ||
| Number of Gates | N/A | ECCN | 5A992C | HTS Code | 8542.31.0001 | ||
| Qualification | N/A | Total RAM Bits | 7782400 |
Overview of MPF100TL-FCVG484E – PolarFire™ FPGA IC, 109,000 logic elements, 484-BFBGA
The MPF100TL-FCVG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC that provides 109,000 logic elements and approximately 7.78 Mbits of embedded memory. It is supplied in a 484-BFBGA surface-mount package with 284 user I/Os, offering a compact platform for programmable logic integration.
Designed as an extended-grade device, the MPF100TL-FCVG484E operates from a core supply of 0.970 V to 1.08 V and across an operating temperature range of 0 °C to 100 °C, delivering a balance of density, I/O capability, and board-level packaging for systems requiring on-chip memory and substantial programmable logic resources.
Key Features
- Logic Capacity Provides 109,000 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory Approximately 7.78 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic.
- I/O Count 284 user I/Os to support broad interfacing options and multi-channel connectivity on a single device.
- Package 484-BFBGA package (supplier device package: 484-FPBGA, 19 × 19) in a surface-mount form factor for compact board integration.
- Power Core voltage supply range of 0.970 V to 1.08 V for defined power domain requirements.
- Temperature & Grade Extended grade device rated for operation from 0 °C to 100 °C.
- Mounting & Compliance Surface-mount mounting type and RoHS compliant for regulatory and assembly compatibility.
Unique Advantages
- High logic density: 109,000 logic elements enable implementation of sizable logic designs without external programmable devices.
- On-chip memory: Approximately 7.78 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
- Generous I/O availability: 284 I/Os allow multiple interfaces and parallel channels to be routed directly to the FPGA package.
- Compact BGA packaging: 484-BFBGA (484-FPBGA 19×19) supports high-density board layouts while maintaining surface-mount assembly.
- Defined power domain: A specified core voltage range (0.970–1.08 V) supports predictable power budgeting and domain design.
- Extended-grade reliability: Rated for 0 °C to 100 °C operation and RoHS compliant, supporting deployments that require extended temperature performance and environmental compliance.
Why Choose MPF100TL-FCVG484E?
The MPF100TL-FCVG484E positions itself as a mid-to-high density PolarFire™ FPGA option that combines substantial logic resources, embedded memory, and a large I/O footprint in a compact 484-BFBGA surface-mount package. Its defined core voltage range and extended-grade temperature rating provide predictable electrical and thermal characteristics for system-level design.
This device is suitable for engineers and procurement teams seeking a programmable logic IC with significant on-chip resources and broad I/O capability, while maintaining RoHS compliance and surface-mount assembly compatibility. The MPF100TL-FCVG484E offers a clear path for scalable, integrated FPGA-based designs backed by the PolarFire product family characteristics included in the provided specifications.
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