MPF100TL-FCSG325E

The MPF100TL-FCSG325E is a PolarFire™ FPGA IC offering significant on-chip logic and memory resources in a compact 325-LFBGA package. It provides 109,000 logic elements and approximately 7.78 Mbits of embedded memory, along with 170 user I/O pins and a low-voltage core supply range.

Designed for applications that require programmable logic capacity with embedded memory and a surface-mount BGA footprint, this device is provided in an extended-grade temperature range to support a broad set of deployment environments.

Key Features

• Core & Logic — 109,000 logic elements provide substantial programmable logic capacity for complex designs and multi-function integration.
• Embedded Memory — Approximately 7.78 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
• I/O Density — 170 I/O pins enable broad peripheral and interface connectivity for sensors, transceivers, and control signals.
• Power — Core voltage supply range of 0.970 V to 1.08 V to match low-voltage system architectures.
• Package & Mounting — 325-LFBGA (325-FCBGA, 11 × 11) surface-mount package offering a compact BGA footprint for space-constrained PCBs.
• Temperature & Grade — Extended-grade device rated for 0 °C to 100 °C operating temperature.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Communications & Networking — Use the device for protocol bridging, packet handling, or interface aggregation where on-chip logic and embedded memory are required.
• Industrial Control — Apply in control and automation tasks that need flexible I/O and programmable logic within the specified temperature range.
• Test & Measurement — Implement custom data acquisition, signal conditioning, and real-time processing leveraging the device’s logic density and embedded RAM.
• Embedded Systems & Prototyping — Ideal for development platforms and embedded designs that benefit from high logic counts and integrated memory in a compact BGA package.

Unique Advantages

• High logic capacity: 109,000 logic elements enable integration of complex functions without external programmable devices.
• Meaningful on‑chip memory: Approximately 7.78 Mbits of embedded RAM reduces dependency on external memory for many use cases.
• Flexible I/O provision: 170 user I/Os accommodate multiple interfaces and peripheral connections on a single device.
• Low-voltage core compatibility: Core supply range of 0.970–1.08 V supports low-voltage system architectures.
• Compact BGA packaging: 325-FCBGA (11×11) enables dense PCB implementation in space-constrained designs.
• Extended operating range: Rated 0 °C to 100 °C to support a wider range of deployment environments.

Why Choose MPF100TL-FCSG325E?

MPF100TL-FCSG325E positions itself as a programmable logic solution that combines substantial logic resources, embedded memory, and a high I/O count in a compact surface-mount BGA package. Its low-voltage core range and extended temperature rating make it suitable for designs that require dependable on-chip capacity and flexible connectivity.

This part is appropriate for engineers and procurement teams seeking an FPGA that consolidates logic and memory on-chip, supports a variety of interfaces through 170 I/Os, and fits space-constrained PCBs while meeting RoHS requirements.

Request a quote or submit a purchase inquiry for MPF100TL-FCSG325E to receive pricing and availability information tailored to your project requirements.