MPF100TL-FCG484E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 244 7782400 109000 484-BFBGA |
|---|---|
| Quantity | 500 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 244 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 27250 | Number of Logic Elements/Cells | 109000 | ||
| Number of Gates | N/A | ECCN | 5A992C | HTS Code | 8542.31.0001 | ||
| Qualification | N/A | Total RAM Bits | 7782400 |
Overview of MPF100TL-FCG484E – PolarFire™ Field Programmable Gate Array (FPGA) IC 244 7782400 109000 484-BFBGA
The MPF100TL-FCG484E is a PolarFire™ field programmable gate array (FPGA) from Microchip Technology. It provides a large pool of programmable logic and on-chip memory combined with 244 general-purpose I/O for system integration in compact BFBGA packaging.
With 109,000 logic elements and approximately 7.78 Mbits of embedded memory, this extended-grade FPGA is suited to designs that require significant logic capacity, substantial embedded RAM, and flexible I/O while operating within a supply range of 970 mV to 1.08 V and a temperature range of 0 °C to 100 °C.
Key Features
- Logic Capacity 109,000 logic elements provide the programmable fabric needed for complex digital designs.
- Embedded Memory Approximately 7.78 Mbits of on-chip RAM supports buffering, state storage, and memory-intensive logic functions.
- I/O Resources 244 I/O pins offer broad interfacing options for peripherals, sensors, and external memory or logic devices.
- Package 484-BFBGA package (supplier device package: 484-FPBGA, 19×19) enables high-density board integration in a surface-mount form factor.
- Power Core voltage supply range of 970 mV to 1.08 V for compatibility with targeted system power domains.
- Temperature and Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C, suitable for applications requiring that thermal range.
- Mounting and Compliance Surface-mount construction and RoHS compliance simplify assembly and meet common environmental requirements.
Typical Applications
- Custom Logic and Accelerators Use the 109,000 logic elements and ~7.78 Mbits of embedded memory to implement hardware accelerators or consolidate discrete logic into a single programmable device.
- Data Aggregation and I/O Bridging The 244 I/O pins support designs that require broad external connectivity and signal routing between subsystems.
- Embedded System Integration Compact 484-BFBGA packaging and surface-mount mounting make this FPGA suitable for space-constrained boards where dense logic and memory are needed.
Unique Advantages
- Substantial Logic Resources: 109,000 logic elements enable complex finite-state machines, datapaths, and custom processing blocks within a single device.
- Significant On-Chip Memory: Approximately 7.78 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
- High I/O Count: 244 I/O pins provide flexibility for interfacing multiple peripherals and external devices without additional bridge components.
- Compact, High-Density Package: 484-BFBGA (484-FPBGA, 19×19) packaging delivers a balance of I/O density and board-area efficiency for modern PCBs.
- Extended-Grade Qualification: Rated for operation from 0 °C to 100 °C to meet thermal needs within that specified range.
- RoHS Compliant: Environmentally compliant construction supports regulatory requirements for many product lines.
Why Choose MPF100TL-FCG484E?
The MPF100TL-FCG484E from Microchip Technology combines a substantial logic element count, sizeable embedded RAM, and a high I/O count in a compact 484-BFBGA surface-mount package. Its extended-grade temperature range and RoHS compliance make it a clear choice for designs that demand integrated logic capacity and flexible I/O within the specified thermal and power envelopes.
This device is well suited to developers and procurement teams building systems that require consolidation of logic, on-chip memory for buffering or state, and broad external connectivity—while relying on Microchip’s PolarFire™ family attributes as represented in the provided specifications.
Request a quote or submit an inquiry today to evaluate MPF100TL-FCG484E for your next design.

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