MPF100T-FCSG325T2

The MPF100T-FCSG325T2 is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology optimized for embedded, high-reliability applications. It delivers a large programmable fabric with 109000 logic elements and approximately 7.97 Mbits of embedded memory, combined with 170 user I/O pins and a compact 325-TFBGA package.

This device is suited for designs that require substantial on-chip logic and memory, deterministic I/O capacity, and automotive-grade qualification for operation across extended temperature ranges.

Key Features

• Programmable Logic: 109000 logic elements provide a sizable FPGA fabric for implementation of complex custom logic, signal processing, and control functions.
• Embedded Memory: Approximately 7.97 Mbits of on-chip RAM for buffers, FIFOs, and local data storage to support high-throughput processing.
• I/O Capacity: 170 user I/O pins enable flexible interfacing with sensors, actuators, comms transceivers, and peripheral devices.
• Power Supply Range: Core voltage supply specified from 970 mV to 1.08 V, supporting targeted power-rail designs.
• Package and Mounting: 325-TFBGA (supplier device package: 325-BGA, 11×11) in a surface-mount form factor for compact PCB integration.
• Automotive Qualification: AEC-Q100 qualification and automotive grade designation for designs requiring automotive-level qualification.
• Operating Temperature: Rated for −40 °C to 125 °C to support wide-temperature deployments.
• Regulatory Compliance: RoHS compliant for environmentally restricted material requirements.

Typical Applications

• Automotive control systems — Implement in-vehicle control, sensor aggregation, and domain-specific logic where AEC-Q100 qualification and wide temperature range are required.
• High-reliability embedded systems — Use the device where extended-temperature operation and verified qualification are necessary for long-term deployed electronics.
• Custom signal processing — Deploy the substantial logic elements and embedded memory for deterministic data buffering and real-time processing tasks.

Unique Advantages

• High logic capacity: 109000 logic elements enable complex, custom architectures without immediate need for external programmable logic expansion.
• Substantial on-chip memory: Approximately 7.97 Mbits of embedded RAM reduces dependency on external memory for many buffering and local storage needs.
• Automotive-grade qualification: AEC-Q100 qualification provides assurance for automotive program requirements and reliability workflows.
• Wide operating temperature: Rated −40 °C to 125 °C to support designs deployed in harsh thermal environments.
• Flexible I/O count: 170 user I/Os simplify interfacing to multiple external devices and subsystems without extensive level-shifting circuitry.
• Compact BGA package: 325-TFBGA (325-BGA, 11×11) offers a dense, surface-mount solution for space-constrained PCBs.

Why Choose MPF100T-FCSG325T2?

MPF100T-FCSG325T2 balances a large programmable fabric and embedded memory with automotive qualification and a compact package, making it a suitable choice for engineers developing robust, high-functionality embedded systems. Its combination of 109000 logic elements, approximately 7.97 Mbits of on-chip RAM, and 170 I/Os supports complex control, data-processing, and interface consolidation in a single device.

Designed and supplied by Microchip Technology, this FPGA option addresses projects that require scalability, deterministic on-chip resources, and qualification for automotive environments, helping teams reduce system complexity and support long-term deployment needs.

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