MPF100T-FCSG325E

The MPF100T-FCSG325E is a PolarFire™ Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a high-capacity reprogrammable logic device with integrated on-chip memory and a substantial I/O count, packaged in a 325-pin LFBGA/FCBGA footprint.

This device targets electronic designs that require significant programmable logic resources, embedded memory, and board-level I/O density while operating from a low-voltage core supply and within an extended temperature range.

Key Features

• Logic Capacity  109,000 logic elements for implementing complex, reconfigurable digital logic and custom datapaths.
• Embedded Memory  Approximately 7.78 Mbits of embedded memory for buffering, lookup tables, and on-chip data storage.
• I/O Resources  170 device I/O pins to support diverse board-level interfacing and parallel signal connectivity.
• Power and Core Supply  Core supply voltage range of 970 mV to 1.08 V, enabling integration into low-voltage system power domains.
• Package and Mounting  Supplied in a 325-LFBGA / 325-FCBGA (11×11) package, surface-mountable for compact board designs.
• Operating Range  Extended grade operation from 0 °C to 100 °C for a wide set of board-level environments.
• Compliance  RoHS-compliant construction.

Typical Applications

• Reconfigurable digital logic  Implement custom processing blocks, state machines, and datapaths that can be updated in the field.
• On-chip buffering and data handling  Use the approximately 7.78 Mbits of embedded memory for packet buffering, FIFOs, and temporary data storage.
• High-density I/O interfacing  Leverage 170 I/O pins for parallel interfaces, sensor arrays, or multi-channel data acquisition.
• Compact board-level integration  The 325-LFBGA / FCBGA package and surface-mount mounting support space-constrained PCB designs.

Unique Advantages

• Significant logic density: 109,000 logic elements allow implementation of large, integrated designs without immediate need for external logic expansion.
• Substantial embedded memory: Approximately 7.78 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
• Robust I/O capability: 170 I/Os provide flexibility for connecting multiple peripherals and parallel interfaces directly to the FPGA fabric.
• Low-voltage core operation: Core supply range of 970 mV to 1.08 V aligns with modern low-voltage system power architectures.
• Board-friendly package: 325-FCBGA (11×11) surface-mount package enables high-density, manufacturable board integration.
• Extended operating range: 0 °C to 100 °C grade supports a broad range of ambient conditions at the board level.

Why Choose MPF100T-FCSG325E?

MPF100T-FCSG325E combines a large logic element count, substantial embedded memory, and a high I/O count in a compact 325-pin LFBGA/FCBGA package. These attributes make it well suited for electronic designs that require on-chip processing, buffering, and flexible interfacing while operating from a low-voltage core supply.

As a PolarFire™ FPGA from Microchip Technology, this device is positioned for engineers and procurement teams seeking a reprogrammable, board-mountable solution with defined electrical, thermal, and package specifications for reliable integration into new or evolving digital designs.

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