MPF100T-FCG484E

The MPF100T-FCG484E is a PolarFire™ Field Programmable Gate Array (FPGA) offered in a 484-ball FCBGA package. It provides a high logic capacity and substantial on-chip memory along with 244 I/O pins, making it suitable for designs requiring dense programmable logic, embedded memory, and significant external interfacing.

Key architectural attributes include 109,000 logic elements, approximately 7.78 Mbits of embedded RAM, a 244-pin I/O count, and operation on a 0.97–1.08 V core supply. The device is RoHS compliant and rated for extended temperature operation from 0 °C to 100 °C.

Key Features

• Logic Capacity — 109,000 logic elements to implement complex digital functions and control logic.
• Logic Blocks — 27,250 logic blocks (as reported) for structured logic partitioning and design mapping.
• Embedded Memory — Approximately 7.78 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• Programmable I/O — 244 general-purpose I/O pins to support broad external interfacing and parallel connections.
• Power — Core supply operating range of 0.97 V to 1.08 V for compatibility with system power domains.
• Package & Mounting — 484-FCBGA (23×23) package in a surface-mount form factor for compact board-level integration.
• Temperature Rating — Extended-grade operation from 0 °C to 100 °C for elevated ambient deployments.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic and prototyping — Use the large logic element count to prototype complex digital systems and validate system architectures.
• Embedded buffering and data handling — On-chip RAM supports local data storage and buffering for data-paths and streaming applications.
• Multi-I/O interfacing — The 244 I/O pins enable aggregation of multiple peripherals, parallel interfaces, and custom I/O arrangements.
• Compact system integration — The 484-FCBGA surface-mount package fits compact PCBs where board space and I/O density matter.

Unique Advantages

• Substantial logic resources: 109,000 logic elements provide the headroom to implement sizeable FPGA designs without immediate upsizing.
• Significant on-chip memory: Approximately 7.78 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 244 I/O pins simplify routing for systems that require multiple parallel interfaces or numerous peripheral connections.
• Compact FCBGA package: 484-ball FCBGA (23×23) supports dense board-level integration while maintaining an organized I/O footprint.
• Extended operating range: Rated for 0 °C to 100 °C operation to meet deployments that require higher ambient temperature tolerance than commercial-only parts.
• Regulatory compliance: RoHS compliance supports usage in environments and products that require lead-free components.

Why Choose MPF100T-FCG484E?

The MPF100T-FCG484E balances high logic density, meaningful embedded memory, and a large I/O complement in a single 484-FCBGA surface-mount package. Its specifications — 109,000 logic elements, approximately 7.78 Mbits of on-chip RAM, 244 I/Os, and a core supply range of 0.97–1.08 V — make it well suited to designs that need significant programmable resources and on-board data handling while conserving board area.

This device is appropriate for development teams and system designers building complex digital logic, data-path buffering, and multi-interface solutions who require the reliability of extended-grade operation and RoHS compliance. Its combination of capacity and package integration supports scalable designs and streamlined BOMs.

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