MPF100T-FCG484T2

The MPF100T-FCG484T2 is a PolarFire™ field-programmable gate array (FPGA) IC offering high logic density and embedded memory in a compact 484-ball BGA package. It provides 109,000 logic elements, approximately 7.97 Mbits of embedded memory and 244 I/O, making it suitable for designs requiring significant on-chip logic and I/O integration.

Qualified to AEC-Q100 for automotive use and rated for operation from −40 °C to 125 °C, this device targets applications that demand extended temperature operation and the reliability expected for automotive-grade electronics.

Key Features

• Logic Capacity — 109,000 logic elements for implementing complex digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 7.97 Mbits of on-chip RAM to support large buffers, state machines, and local data storage.
• I/O Density — 244 user I/O pins to interface with sensors, peripherals, and board-level signals.
• Automotive Qualification — AEC-Q100 qualification and listed as Automotive grade for use in automotive electronic systems.
• Thermal Range — Rated for operation from −40 °C to 125 °C to meet extended temperature requirements.
• Power Supply — Core voltage supply range of 0.970 V to 1.08 V to match system power rails.
• Package and Mounting — 484-FPBGA (23 × 23 mm) surface-mount package providing a compact footprint for high-density PCBs.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Automotive electronic systems — Suited for in-vehicle systems that require AEC-Q100 qualification and extended temperature operation.
• High-density embedded platforms — Ideal for compact designs that need significant logic capacity and many I/O in a small BGA package.
• Harsh-environment electronics — Deployment in systems requiring reliable operation across −40 °C to 125 °C.

Unique Advantages

• High logic integration: 109,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 7.97 Mbits of embedded RAM supports data buffering and state storage without external memory.
• Automotive-ready qualification: AEC-Q100 qualification indicates suitability for automotive electronic designs requiring industry-recognized qualification.
• Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally demanding environments.
• Compact, high-pin-count package: 484-FPBGA (23×23) with 244 I/O offers dense connectivity while minimizing PCB area.
• Controlled core supply range: 0.970 V to 1.08 V core supply accommodates designs with defined power-rail constraints.

Why Choose MPF100T-FCG484T2?

The MPF100T-FCG484T2 positions itself as a high-density, automotive-qualified FPGA solution combining substantial logic resources, nearly 8 Mbits of embedded memory and 244 I/O in a compact 484-ball FPBGA package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it appropriate for automotive and other applications requiring robust temperature performance and recognized qualification.

Engineers and procurement teams seeking a reliable, high-capacity FPGA for automotive-grade and rugged embedded systems will find this device offers integration and performance that help reduce component count and simplify board design while meeting demanding environmental requirements.

Request a quote or submit an RFQ today to begin procurement of MPF100T-FCG484T2 and to confirm availability and lead times.