MPF100T-FCSG325I

The MPF100T-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade embedded and control applications. It provides a mid-to-high logic capacity architecture with a combination of programmable logic, on-chip memory, and flexible I/O in a compact 325-pin FCBGA package.

Key Features

• Programmable Logic Capacity — 109,000 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 7.78 Mbits of embedded memory (7,782,400 total RAM bits) for buffering, state storage, and data processing.
• I/O Density — 170 user I/O pins to support multiple interfaces and peripheral connections.
• Package and Mounting — 325-LFBGA, FCBGA package; supplier device package specified as 325-FCBGA (11×11). Surface-mount device for compact board-level integration.
• Power — Core supply range of 970 mV to 1.08 V to match modern low-voltage power rails.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployed systems in industrial environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, sequencing, and I/O aggregation for factory or process automation systems using industrial temperature-rated hardware.
• Embedded Systems — Provide on-chip logic and memory for embedded compute tasks, protocol bridging, and hardware acceleration in compact designs.
• Communication and Interface Aggregation — Consolidate multiple interfaces and implement protocol conversion using the available I/O and programmable logic resources.

Unique Advantages

• High Logic Capacity: 109,000 logic elements enable implementation of sizable custom logic blocks without external glue logic.
• Substantial On-Chip Memory: Approximately 7.78 Mbits of embedded memory reduces dependence on external RAM for buffering and state storage.
• Industrial-Grade Operation: −40°C to 100°C operating range supports reliable deployment in industrial environments.
• Compact, High-Density Package: 325-FCBGA (11×11) package with 170 I/O allows dense system integration in space-constrained boards.
• Low-Voltage Core Compatibility: Core supply range of 970 mV to 1.08 V aligns with modern power architectures for efficient board-level power design.
• Regulatory Compliance: RoHS compliance supports use in regions and systems requiring restricted-substance adherence.

Why Choose MPF100T-FCSG325I?

The MPF100T-FCSG325I positions itself as an industrial-grade PolarFire FPGA option that balances logic density, embedded memory, and I/O capability in a compact 325-pin FCBGA package. Its 109,000 logic elements and approximately 7.78 Mbits of on-chip RAM suit designs that require substantial programmable logic and local storage without expanding board-level component count.

Designed for industrial environments, the device’s −40°C to 100°C rating, surface-mount 325-FCBGA package, and 170 I/O pins make it a practical choice for engineers developing robust embedded control, communication aggregation, and interface consolidation solutions where integration and reliable operation are required.

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