MPF100T-1FCSG325T2

The MPF100T-1FCSG325T2 is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology. It provides 109,000 logic elements and approximately 7.97 Mbits of embedded memory in a compact 325‑TFBGA package.

Engineered for automotive environments with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C, this surface-mount FPGA offers 170 I/Os and a core supply voltage range of 0.970 V to 1.08 V for low-voltage system integration.

Key Features

• Core Logic  109,000 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 7.97 Mbits of on-chip RAM to support buffers, FIFOs and local data storage within the fabric.
• I/O Count  170 general-purpose I/Os to connect sensors, peripherals and high-density interfaces.
• Power  Core voltage supply range from 0.970 V to 1.08 V to support low-voltage designs and predictable power budgeting.
• Package & Mounting  325‑TFBGA (supplier package: 325‑BGA, 11×11) in a surface-mount format for compact board-level integration.
• Automotive Qualification  AEC-Q100 qualification and Automotive grade designation for use in demanding automotive temperature and reliability conditions.
• Operating Range  Rated for −40 °C to 125 °C to meet broad temperature requirements in harsh environments.
• Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Automotive Control Systems  Use as a programmable hardware engine for engine control, body electronics or other vehicle subsystems requiring automotive qualification and wide temperature range.
• Sensor Aggregation and Preprocessing  Consolidate and preprocess data from multiple sensors using the device’s logic capacity and on-chip memory.
• In-vehicle Networking  Implement protocol bridging, signal conditioning or custom I/O logic leveraging 170 I/Os and configurable fabric.
• Embedded System Integration  Replace or augment discrete components to reduce BOM and centralize control functions in a single programmable device.

Unique Advantages

• High Logic Density: 109,000 logic elements enable consolidation of complex functions and reduce the need for multiple discrete ICs.
• Significant On-chip Memory: Approximately 7.97 Mbits of embedded RAM supports local buffering and deterministic data handling without external memory.
• Automotive-Ready Qualification: AEC-Q100 qualification and Automotive grade designation support deployment in vehicle systems that require proven component reliability.
• Wide Temperature Range: −40 °C to 125 °C rating meets thermal requirements for harsh operational environments.
• Compact Surface-Mount Package: 325‑TFBGA (11×11) minimizes board area while providing high I/O density for space-constrained designs.
• Low-Voltage Core: 0.970 V–1.08 V supply supports efficient power design and predictable power planning.

Why Choose MPF100T-1FCSG325T2?

The MPF100T-1FCSG325T2 combines substantial logic capacity, embedded memory and a high I/O count within a compact, surface-mount 325‑TFBGA package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range position it for automotive applications and other environments that demand robustness and temperature resilience.

As a member of the PolarFire™ family from Microchip Technology, this FPGA is suited for designs that require significant on-chip resources, reliable operation under automotive conditions, and the flexibility of programmable logic to consolidate system functions and reduce board-level complexity.

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