MPF100T-1FCG484T2
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 244 7969178 109000 484-BGA |
|---|---|
| Quantity | 165 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 244 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 27250 | Number of Logic Elements/Cells | 109000 | ||
| Number of Gates | N/A | ECCN | 5A992C | HTS Code | 8542.31.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 7969178 |
Overview of MPF100T-1FCG484T2 – PolarFire™ Field Programmable Gate Array, 484-BGA, 109000 Logic Elements
The MPF100T-1FCG484T2 is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high logic capacity fabric with on-chip embedded memory and a broad set of I/O to support complex digital designs.
Key characteristics in the specification include 109,000 logic elements, approximately 7.97 Mbits of embedded memory, 244 I/Os, a 484-pin FPBGA package (23 × 23 mm), low-voltage core operation at 0.97–1.08 V, and an operating temperature range of −40 °C to 125 °C. The device is AEC-Q100 qualified and listed as Automotive grade, and it is RoHS compliant.
Key Features
- Logic Capacity 109,000 logic elements to implement sizeable digital functions and complex logic networks.
- Embedded Memory Approximately 7.97 Mbits of on-chip RAM for buffering, state storage, and data processing.
- I/O and Package 244 I/Os in a 484-FPBGA (23 × 23 mm) package (484-BGA package case) for dense board-level connectivity.
- Power Core voltage supply range of 0.97–1.08 V to match low-voltage system designs and power domains.
- Thermal and Mechanical Surface-mount 484-FPBGA package designed for compact PCB integration; operating temperature range −40 °C to 125 °C.
- Qualification and Compliance Automotive grade with AEC-Q100 qualification and RoHS compliance for regulated manufacturing environments.
Typical Applications
- Automotive Electronics AEC-Q100 qualification and an extended −40 °C to 125 °C operating range make the device suitable for automotive control and vehicle subsystem designs that require qualified components.
- High-Density I/O Systems 244 I/Os in a compact 484-FPBGA package enable designs that need extensive external interfacing while maintaining a small PCB footprint.
- Complex Digital Processing Large logic element count and substantial on-chip RAM support sophisticated digital functions, state machines, and buffering on a single FPGA device.
Unique Advantages
- High Logic Integration: 109,000 logic elements provide capacity for complex or multi-function designs without partitioning across multiple devices.
- Significant Embedded Memory: Approximately 7.97 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage tasks.
- Compact, High-Pin-Count Package: 484-FPBGA (23 × 23 mm) with 244 I/Os balances connectivity and board-space efficiency.
- Automotive Proven: AEC-Q100 qualification and Automotive grade designation indicate suitability for applications requiring that level of qualification.
- Wide Operating Range: −40 °C to 125 °C supports deployment in thermally demanding environments.
- Low-Voltage Core Operation: Core supply range of 0.97–1.08 V aligns with low-voltage system power rails.
Why Choose MPF100T-1FCG484T2?
The MPF100T-1FCG484T2 positions itself as a robust PolarFire FPGA option where high logic capacity, substantial embedded memory, and a large number of I/Os are required within a compact BGA package. Its AEC-Q100 qualification and wide operating temperature range make it appropriate for designs that require automotive-grade component qualification.
For engineering teams targeting applications that demand dense logic, onboard memory resources, and qualified operation across harsh temperature conditions, this device provides a specification-driven platform to consolidate functionality while meeting voltage and thermal constraints.
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