MPF050TS-FCSG325I

The MPF050TS-FCSG325I is a high-density Field Programmable Gate Array (FPGA) from Microchip Technology designed for complex, embedded digital designs. It combines a very large logic fabric with multi-megabit on-chip memory, a 164-pin I/O count and a compact 325-TFBGA surface-mount package to address demanding industrial applications that require high integration and wide operating temperature support.

Key Features

• Core / Logic: 3,774,874 logic elements to support large-scale combinational and sequential logic implementations.
• Embedded Memory: Approximately 3.6 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing.
• I/O Capacity: 164 general-purpose I/Os enabling extensive external interfacing and signal routing for peripherals and subsystems.
• Power: Core voltage range 0.97 V to 1.08 V, suitable for low-voltage FPGA core domains.
• Package & Mounting: 325-TFBGA package (supplier device package: 325-BGA, 11×11) in a surface-mount form factor for compact board integration.
• Temperature & Grade: Industrial grade device with an operating temperature range of −40°C to 100°C for use in temperature-challenging environments.
• Environmental Compliance: RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems: High logic capacity and industrial temperature rating make the device suitable for complex control, signal processing, and automation tasks.
• Data Processing & Acceleration: Large logic element count and on-chip RAM support hardware acceleration and custom packet/data handling functions.
• High-Density Embedded Systems: Compact 325-TFBGA package and 164 I/Os enable dense board-level integration for space-constrained designs.

Unique Advantages

• Very high logic capacity: 3,774,874 logic elements allow implementation of large, multi-function digital designs without external logic expansion.
• Integrated on-chip RAM: Approximately 3.6 Mbits of embedded memory reduces dependence on external memory for buffering and accelerates data paths.
• Wide operating temperature span: −40°C to 100°C supports deployment in industrial and temperature-variable environments.
• Compact, surface-mount package: 325-TFBGA (325-BGA, 11×11) enables high-density PCB layouts while retaining substantial I/O capability.
• Low-voltage core support: 0.97 V to 1.08 V supply range aligns with modern low-voltage design requirements.
• RoHS compliant: Environmentally compliant for broader manufacturing acceptance.

Why Choose MPF050TS-FCSG325I?

The MPF050TS-FCSG325I positions itself as a high-capacity, industrial-grade FPGA option from Microchip Technology suitable for designs that require substantial logic resources, embedded memory, and a reliable operating range. Its combination of nearly 3.8 million logic elements, several megabits of on-chip RAM, and 164 I/Os provides designers with the resources to consolidate functionality and reduce external component count.

This device is well suited for engineering teams building complex embedded systems, industrial controllers, and high-density processing modules where long-term robustness, compact packaging, and deterministic hardware resources are priorities.

Request a quote or submit a purchase inquiry today to evaluate the MPF050TS-FCSG325I for your next design.