MPF050TLS-FCSG325I

The MPF050TLS-FCSG325I is a high-density Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade applications. It provides a very large logic fabric combined with on-chip embedded memory and a compact 325-TFBGA package for space-constrained designs.

With millions of logic elements, substantial embedded RAM, and 164 I/O pins, this device targets applications that require high integration, flexible logic implementation, and reliable operation across a wide temperature range.

Key Features

• Core Logic  Approximately 3,774,874 logic elements available to implement complex digital functions and high-density designs.
• Embedded Memory  Approximately 3.6 Mbits of embedded memory for buffering, state machines, and on-chip data storage.
• I/O and Package  164 I/O pins in a 325-TFBGA (325-BGA, 11×11) package, providing a compact surface-mount solution for multi-signal connectivity.
• Power  Core voltage supply range from 970 mV to 1.08 V to match low-voltage system architectures.
• Temperature and Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Mounting and Compliance  Surface-mount package and RoHS-compliant construction to meet industry lead-free requirements.

Typical Applications

• Industrial Automation  Use the device for control logic, I/O aggregation, and deterministic processing in industrial equipment thanks to its industrial temperature rating and high logic density.
• Communications and Networking  Implement protocol engines, packet processing, and interface bridging using the large logic fabric and abundant I/O.
• Test & Measurement  Drive custom measurement logic and real-time data handling with on-chip RAM and extensive programmable logic resources.
• Embedded System Integration  Consolidate multiple functions on a single FPGA to reduce board-level complexity in embedded platforms that require compact package options.

Unique Advantages

• Very High Logic Capacity: The device’s approximately 3.8 million logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Significant On-chip Memory: Approximately 3.6 Mbits of embedded RAM supports buffering and stateful processing close to the logic, reducing external memory dependency.
• Compact, High-pin Package: The 325-TFBGA (11×11) package delivers 164 I/Os in a small footprint, helping to minimize PCB area while maintaining connectivity.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in challenging environmental conditions.
• Low-Voltage Core Operation: Core supply from 970 mV to 1.08 V aligns with modern low-voltage system designs to help manage power budgets.
• RoHS Compliant: Meets lead-free and environmental compliance requirements for contemporary manufacturing processes.

Why Choose MPF050TLS-FCSG325I?

The MPF050TLS-FCSG325I combines extremely large logic capacity, meaningful embedded memory, and a compact 325-TFBGA package to address designs that need high integration and reliable operation in industrial environments. Its combination of 164 I/Os, industrial temperature rating, and low-voltage core supply makes it a strong choice for systems that consolidate functionality and require robust on-board processing.

Backed by Microchip Technology, this FPGA is suited for engineers and system designers building complex digital subsystems where scalability, integration, and compliance with industrial operating conditions are priorities.

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