MPF050TL-FCSG325E

The MPF050TL-FCSG325E is a Field Programmable Gate Array (FPGA) from Microchip Technology supplied in a 325‑TFBGA package. It provides a high logic capacity with 3,774,874 logic elements and approximately 3.6 Mbits of embedded memory, together with 164 available I/O pins.

With a low-voltage core supply range and extended-grade qualification, this device targets designs that require dense programmable logic, substantial on-chip memory, and a compact BGA package for surface-mount applications.

Key Features

• Core Logic Capacity 3,774,874 logic elements suitable for complex, high-density logic implementations and large-scale programmable functions.
• Embedded Memory Approximately 3.6 Mbits of on-chip RAM to support buffering, state storage, and data processing tasks without external memory in many use cases.
• I/O Count 164 I/O pins provide ample connectivity for multi-channel interfaces, peripheral integration, and system-level signal routing.
• Power and Voltage Core supply range of 970 mV to 1.08 V to match low-voltage system architectures and power-optimized designs.
• Package and Mounting 325‑TFBGA package (supplier device package: 325‑BGA, 11×11) in a surface-mount format for compact PCB integration.
• Temperature and Grade Extended grade with an operating temperature range of 0 °C to 100 °C for applications within this environmental envelope.
• Compliance RoHS compliant material status to meet lead-free and environmental requirements.

Typical Applications

• High‑density signal processing — Large logic capacity and embedded memory support complex data paths, DSP pipelines, and custom accelerators.
• Communication and networking equipment — 164 I/O and substantial logic resources enable multi-channel interfacing and packet-processing functions.
• Embedded compute and system control — On-chip RAM and extensive logic elements are useful for system controllers, protocol handling, and hardware offload tasks.
• Prototyping and development platforms — High logic density supports evaluation of large designs and integration of multiple functions into a single device.

Unique Advantages

• Large single‑device logic capacity: 3,774,874 logic elements reduce the need for multi-chip partitioning and simplify board-level design.
• Substantial embedded memory: Approximately 3.6 Mbits of on-chip RAM lowers dependency on external memory components for many buffering and stateful functions.
• High I/O density: 164 I/O pins provide flexibility to connect multiple peripherals, lanes, or parallel interfaces without additional interface chips.
• Compact BGA footprint: 325‑TFBGA (11×11) allows dense placement on modern PCBs while maintaining a surface-mount profile.
• Low-voltage core operation: 970 mV to 1.08 V core supply helps align with low-power system designs and modern power rails.
• Extended temperature grade: Rated for 0 °C to 100 °C operation for deployments within this thermal window.

Why Choose MPF050TL-FCSG325E?

The MPF050TL-FCSG325E combines very large logic capacity, meaningful embedded memory, and a high I/O count in a compact 325‑TFBGA surface-mount package. Its low-voltage core range and extended-grade operating window make it a practical choice for designers who need dense programmable logic and on-chip resources in space-constrained boards.

This device is suited for customers building advanced embedded systems, communications hardware, and compute-accelerator applications where consolidating functionality into a single FPGA reduces BOM complexity and simplifies system architecture.

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