MPF050T-FCSG325T2

The MPF050T-FCSG325T2 is a Microchip Technology PolarFire family Field Programmable Gate Array (FPGA) supplied in a 325-TFBGA (325-ball, 11×11) surface-mount package. It integrates approximately 48,000 logic elements and roughly 3.77 Mbits of embedded memory, making it suitable for designs that require significant logic capacity and on-chip RAM.

Designed and qualified for automotive environments (AEC‑Q100), this device operates from 0.97 V to 1.08 V core supply and supports an extended junction temperature range from –40 °C to 125 °C. The part provides 164 user I/Os and is RoHS compliant.

Key Features

• Logic Capacity — Approximately 48,000 logic elements for mid-to-high density FPGA implementations.
• Embedded Memory — Approximately 3.77 Mbits of on-chip RAM for buffering, packet processing, and local storage.
• I/O Resources — 164 general-purpose I/Os to support a wide variety of external interfaces and peripherals.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade designation with a maximum junction temperature up to 125 °C.
• Package and Mounting — 325-TFBGA package (supplier device package: 325-BGA 11×11), surface-mount for compact board designs.
• Core Voltage — Low-voltage core operation from 0.97 V to 1.08 V.
• Operating Range — Rated for operation from –40 °C to 125 °C.
• Regulatory — RoHS compliant.
• Programming Temperature Note — PolarFire device programming functions (programming, verify, and digest check) are only allowed over the Industrial temperature range regardless of the temperature grade of the device selected; consult product documentation for programming and retention guidance.

Typical Applications

• Automotive Electronic Systems — AEC‑Q100 qualification and –40 °C to 125 °C operating range support use in automotive control, infotainment, and driver-assistance subsystems where temperature resilience is required.
• Embedded Processing — Large logic capacity and several megabits of on-chip RAM enable protocol bridging, packet processing, and custom hardware acceleration in embedded platforms.
• Industrial Control — Robust operating temperature range and high I/O count allow deployment in industrial automation, motor control, and sensor aggregation applications.

Unique Advantages

• Automotive-Grade Reliability: AEC‑Q100 qualification and extended temperature capability support deployment in demanding vehicle environments.
• High Logic Density: Approximately 48,000 logic elements provide the ability to implement complex state machines, custom datapaths, and hardware accelerators while minimizing board-level component count.
• Substantial On-Chip Memory: Approximately 3.77 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching tasks.
• Generous I/O Count: 164 user I/Os allow flexible system integration without immediate need for I/O expanders.
• Compact BGA Package: 325-TFBGA (11×11) offers a compact footprint for space-constrained designs while supporting high pin density.
• Low-Voltage Core Operation: 0.97 V to 1.08 V core supply supports modern low-power system architectures.

Why Choose MPF050T-FCSG325T2?

The MPF050T-FCSG325T2 positions itself as a robust, automotive-qualified FPGA option within the PolarFire family, delivering a balance of logic density, embedded memory, and I/O resources in a compact BGA package. Its AEC‑Q100 qualification and extended temperature range make it a practical choice for vehicle electronics and other environments that demand reliability across wide temperatures.

Engineers and procurement teams seeking a field-programmable device with substantial on-chip resources, automotive-grade qualification, and a compact footprint will find the MPF050T-FCSG325T2 appropriate for mid-to-high complexity FPGA-based designs. Detailed programming, retention, and temperature-specific guidance is available in the PolarFire documentation and should be reviewed when integrating this device into production systems.

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