MPF050T-FCSG325E

The MPF050T-FCSG325E is a Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for high-density, programmable digital logic implementations. With 3,774,874 logic elements and approximately 3.6 Mbits of embedded memory, this device targets applications that require significant on-chip logic and memory resources while delivering configurable I/O and modern package options.

Packaged in a 325-TFBGA (325-BGA, 11×11) surface-mount case and rated for extended-grade operation from 0°C to 100°C, the device is suited to systems that need a large programmable fabric combined with compact board-level integration and a low-voltage core supply range.

Key Features

• Logic Capacity  Provides 3,774,874 logic elements to implement large-scale programmable digital functions and complex custom logic.
• Embedded Memory  Approximately 3.6 Mbits of on-chip RAM to support packet buffering, state machines, and other memory-intensive logic blocks.
• I/O  164 user I/O pins for flexible interfacing to peripherals, buses, and external devices.
• Power  Core voltage supply range of 970 mV to 1.08 V enabling low-voltage operation for modern FPGA fabrics.
• Package & Mounting  325-TFBGA (supplier package: 325-BGA, 11×11) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Extended grade device rated for operation from 0°C to 100°C.
• Compliance  RoHS-compliant construction for regulatory and environmental alignment.

Typical Applications

• High-density digital systems  Use the device where substantial logic and embedded memory are required for custom datapath and control implementations.
• Custom hardware acceleration  Deploy as a configurable accelerator for offloading compute or signal-processing tasks within a larger system.
• Complex I/O aggregation  Leverage 164 I/O pins to consolidate multiple interfaces and simplify board-level integration.

Unique Advantages

• High logic integration: 3,774,874 logic elements enable consolidation of multiple functions into a single programmable device, reducing BOM count.
• On-chip memory support: Approximately 3.6 Mbits of embedded RAM supports local buffering and state retention without external memory dependencies.
• Compact packaging: 325-TFBGA (11×11) surface-mount package offers a balance of pin count and board space efficiency for dense designs.
• Low-voltage core operation: 970 mV to 1.08 V supply range aligns with modern low-power FPGA cores for optimized power profiles.
• Extended-grade operation: Rated 0°C to 100°C for deployments that require broader-than-standard commercial temperature range.
• RoHS compliance: Conforms to RoHS environmental requirements for lead-free assembly and regulatory alignment.

Why Choose MPF050T-FCSG325E?

The MPF050T-FCSG325E delivers a high-capacity programmable fabric combined with substantial embedded memory and extensive I/O in a compact 325-TFBGA surface-mount package. Its combination of logic resources, on-chip RAM, and an extended operating temperature range makes it suitable for engineers implementing large-scale, configurable digital systems that require integration and flexibility.

Manufactured by Microchip Technology and offered as a RoHS-compliant, extended-grade FPGA, the MPF050T-FCSG325E is aimed at designs that prioritize on-chip capacity, compact packaging, and precise voltage requirements for modern low-voltage cores.

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