MPF050T-1FCSG325T2

MPF050T-1FCSG325T2
Part Description

Field Programmable Gate Array (FPGA) IC 164 3774874 48000 325-TFBGA

Quantity 1,013 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package325-BGA (11x11)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case325-TFBGANumber of I/O164Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs48000Number of Logic Elements/Cells48000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationAEC-Q100Total RAM Bits3774874

Overview of MPF050T-1FCSG325T2 – Field Programmable Gate Array (FPGA) — 164 I/Os, ~3.77 Mbits RAM, 48,000 logic elements, 325-TFBGA

The MPF050T-1FCSG325T2 is a PolarFire® family field programmable gate array (FPGA) device from Microchip Technology, packaged in a 325‑TFBGA (11×11) form factor. It provides a high logic element count and embedded RAM capacity designed for systems that require significant on-chip programmable logic and memory.

With AEC‑Q100 automotive qualification and an extended junction temperature range, this device addresses applications requiring automotive-grade qualification and high-temperature operation while exposing a broad set of FPGA resources for protocol handling, signal processing, and custom logic implementation.

Key Features

  • Logic Capacity  48,000 logic elements (reported as 48,000 CLBs) to implement complex digital functions and custom accelerators.
  • Embedded Memory  Approximately 3.77 Mbits of on-chip RAM for buffering, packet handling, and intermediate data storage.
  • I/O Count  164 user I/O pins to support multiple peripheral interfaces and system interconnects.
  • Automotive Qualification  AEC‑Q100 qualified (Automotive T2 grade), supporting operation up to 125 °C junction temperature where specified by the device grade.
  • Operating Range  Rated for operation from −40 °C to 125 °C junction temperature for the Automotive AEC‑Q100 (T2) grade.
  • Core Voltage  Core supply voltage range of 0.970 V to 1.08 V to match system power-rail requirements.
  • Package and Mounting  325‑ball TFBGA (325‑BGA, 11×11) surface-mount package for compact board integration.
  • Environmental Compliance  RoHS compliant, meeting common environmental and lead‑free requirements.

Typical Applications

  • Automotive systems  Engine control, sensor fusion, and vehicle subsystem logic where AEC‑Q100 qualification and extended temperature range are required.
  • High-speed networking and communications  Designs leveraging the PolarFire family’s documented Ethernet and transceiver capabilities for 1G/10G and protocol bridging.
  • PCI Express and host interfaces  Systems requiring configurable protocol handling and custom logic for PCIe-based data paths, supported by PolarFire PCI Express documentation.
  • Memory and storage controllers  On‑chip RAM capacity and logic density suit applications requiring embedded memory controllers and buffering.

Unique Advantages

  • Automotive-grade qualification: AEC‑Q100 (T2) qualification and a specified junction temperature range give confidence for automotive and harsh‑environment deployments.
  • Substantial programmable resources: 48,000 logic elements combined with ~3.77 Mbits of embedded RAM enables large custom logic designs without relying solely on external memory.
  • High pin count in a compact package: 164 I/Os in a 325‑TFBGA (11×11) package supports dense system interconnects while keeping PCB footprint compact.
  • Controlled core voltage range: Core supply between 0.970 V and 1.08 V facilitates integration with modern low-voltage power architectures.
  • Comprehensive documentation and family support: The PolarFire datasheet and family user guides provide detailed electrical, timing, and application-level references to accelerate development.
  • RoHS compliance: Meets environmental lead‑free directives for a wide range of commercial and automotive programs.

Why Choose MPF050T-1FCSG325T2?

The MPF050T-1FCSG325T2 combines sizable logic density, meaningful on‑chip RAM, and an automotive AEC‑Q100 qualification in a compact 325‑TFBGA package. This combination makes it suited for designs that require deterministic, board‑level programmable logic and memory resources under automotive temperature and qualification constraints.

Engineers targeting automotive or similarly demanding markets will find the device’s documented PolarFire family resources and datasheet references helpful for system integration, timing closure, and protocol implementation, enabling sustained product development and deployment.

Request a quote or submit a procurement inquiry to receive pricing and availability for MPF050T-1FCSG325T2. Include part number, required quantity, and target program timelines to expedite your request.

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