MPF050T-1FCSG325E

The MPF050T-1FCSG325E is a Field Programmable Gate Array (FPGA) IC designed for high-density logic integration. It combines a large count of logic elements with embedded memory and a high I/O complement to support complex, tightly integrated digital designs.

With an extended-grade temperature rating and a compact 325‑TFBGA package, this device targets applications that require significant programmable logic capacity, on-chip memory, and a high number of external interfaces while operating at a low core voltage.

Key Features

• Logic Capacity — Contains 48,000 CLBs and 3,774,874 logic elements, providing substantial programmable fabric for complex designs and high gate-count implementations.
• Embedded Memory — Approximately 3.6 Mbits of on-chip RAM to support buffering, state storage, and data-path requirements without external memory for many functions.
• I/O Count — 164 user I/O pins to accommodate multiple interfaces, parallel buses, and mixed-signal front-end connections.
• Power Profile — Core supply range of 0.970 V to 1.08 V suitable for low-voltage system domains and modern power-optimized designs.
• Package — 325‑TFBGA / 325‑BGA (11×11) surface-mount package that balances board-area efficiency with thermal and routing considerations.
• Temperature and Grade — Extended-grade device rated for operation from 0 °C to 100 °C for deployments requiring broader commercial temperature tolerance.
• Compliance — RoHS compliant to meet environmental and manufacturing standards for lead-free assembly.

Typical Applications

• High-density digital systems — Use the device's large logic element count to implement complex state machines, packet processing, or custom instruction accelerators.
• Embedded memory–centric designs — Leverage approximately 3.6 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage without immediate external memory requirements.
• I/O‑intensive interfaces — Deploy in systems that require many parallel or mixed I/O connections, taking advantage of the 164 available I/Os for peripheral and sensor interfacing.
• Low-voltage system integration — Integrate into modern power-sensitive designs that operate around a 0.97–1.08 V core supply.

Unique Advantages

• High programmable density: Large CLB and logic element counts enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 3.6 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and improving system latency.
• Generous I/O resources: 164 I/Os provide flexibility for multi‑interface designs, simplifying routing of external signals and peripherals.
• Compact package footprint: The 325‑TFBGA (11×11) package offers a space-efficient solution for high-pin-count FPGAs in surface-mount assemblies.
• Extended-temperature readiness: Rated for 0 °C to 100 °C operation to support applications that require broader commercial‑grade thermal tolerance.
• RoHS compliance: Meets lead-free manufacturing requirements for environmentally conscious production processes.

Why Choose MPF050T-1FCSG325E?

The MPF050T-1FCSG325E positions itself as a high-capacity, low-voltage FPGA for designs that need substantial programmable logic, embedded memory, and a large I/O complement in a compact surface-mount package. Its extended temperature range and RoHS compliance make it suitable for a wide range of commercial and industrial embedded applications that demand integration and scalability.

Engineers and procurement teams seeking a single-chip solution to reduce BOM complexity, centralize digital functions, and support intensive on-chip data handling will find this device well suited to designs that prioritize logic density, memory resources, and flexible I/O in a 325‑TFBGA package.

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