MPF050T-1FCSG325I

The MPF050T-1FCSG325I is a Field Programmable Gate Array (FPGA) integrated circuit from Microchip Technology, delivered in a 325-TFBGA (325-BGA, 11×11) surface-mount package with 164 user I/O. It integrates 3,774,874 logic elements and approximately 3.6 Mbits of embedded memory to support high-density logic implementations.

Rated for industrial use, this device operates from 0.97 V to 1.08 V and over an operating temperature range of −40° C to 100° C, providing a combination of logic capacity, memory, and I/O in a compact package for temperature-demanding environments.

Key Features

• Core Capacity  3,774,874 logic elements for implementing large-scale programmable logic functions and complex designs.
• Embedded Memory  Approximately 3.6 Mbits of on-chip RAM to support buffers, state machines, and local data storage without external memory.
• I/O Count  164 general-purpose I/O pins enabling multiple peripheral interfaces and parallel signal paths.
• Power  Low-voltage core operation with a supply range from 0.97 V to 1.08 V to match system power budgets.
• Package & Mounting  325-TFBGA (325-BGA, 11×11) surface-mount package for a high pin-count, compact footprint.
• Temperature & Grade  Industrial grade device rated for −40° C to 100° C operation for use in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  High logic density and 164 I/O support complex control algorithms, sensor interfacing, and actuator control in industrial systems operating across wide temperature ranges.
• Signal Processing  Large logic element count and embedded memory enable implementation of custom, high-throughput processing pipelines and buffering on-chip.
• Communications & Networking  Multiple I/O and dense logic resources allow protocol handling, packet processing, and interface bridging within a compact BGA package.

Unique Advantages

• High logic integration: 3,774,874 logic elements let you consolidate complex functions into a single device, reducing board-level component count.
• On-chip memory: Approximately 3.6 Mbits of embedded RAM minimizes the need for external memory, simplifying design and lowering BOM cost.
• Ample I/O in compact package: 164 I/O pins in a 325-TFBGA (11×11) footprint balance high connectivity with a small PCB area.
• Industrial temperature rating: −40° C to 100° C specification supports deployment in temperature-challenging applications.
• Low-voltage core: 0.97 V to 1.08 V supply range aligns with modern low-voltage system architectures to help manage power budgets.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly and regulatory needs.

Why Choose MPF050T-1FCSG325I?

The MPF050T-1FCSG325I combines high logic capacity, embedded memory, and a substantial I/O count in a compact 325-TFBGA package, making it a strong choice for industrial designs that require dense programmable logic and reliable operation across a wide temperature range. Its low-voltage core and on-chip RAM help reduce external components and simplify system power and memory architecture.

This device is well suited for engineering teams building scalable, robust solutions where integration density, predictable thermal performance, and industrial-grade operation are primary concerns. Its specification set supports consolidation of functionality and long-term deployment in demanding environments.

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