MPF050T-1FCVG484E

The MPF050T-1FCVG484E is a Field Programmable Gate Array (FPGA) IC offering high logic density and substantial on-chip memory for complex digital designs. It delivers 3,774,874 logic elements and approximately 3.6 Mbits of embedded memory to support large-scale programmable logic implementations.

Designed for surface-mount deployment in a 484-BFBGA (484-FBGA, 19×19) package, the device provides 176 I/O pins, operates from a 0.970 V to 1.080 V supply range, and is specified for an operating temperature range of 0 °C to 100 °C. The part is RoHS compliant and graded as Extended.

Key Features

• Core / Logic Capacity 3,774,874 logic elements and approximately 48,000 logic blocks provide large-scale programmable logic resources for complex functions and parallel processing.
• Embedded Memory Total on-chip RAM of 3,600,000 bits (approximately 3.6 Mbits) supports buffering, lookup tables, and state storage within the FPGA fabric.
• I/O and Package 176 user I/O pins in a 484-BFBGA (484-FBGA, 19×19) ball grid array enable dense external connectivity while minimizing board footprint.
• Power Core supply range of 0.970 V to 1.080 V supports low-voltage operation consistent with modern FPGA power domains.
• Mounting and Mechanical Surface-mount package in a 484-BFBGA footprint facilitates automated PCB assembly and compact system integration.
• Temperature and Grade Extended grade with an operating temperature range of 0 °C to 100 °C suited to applications within that thermal window.
• Environmental RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• High-density digital processing — Large logic capacity and on-chip memory enable implementation of complex processing pipelines and parallel algorithms.
• Connectivity and interface aggregation — 176 I/O pins and a compact BFBGA package support dense external interfacing and board-level system integration.
• Embedded system integration — The combination of logic resources and embedded RAM supports custom control, protocol handling, and acceleration functions within embedded products.

Unique Advantages

• High logic capacity: 3,774,874 logic elements provide headroom for large-scale designs and IP integration.
• Substantial embedded memory: Approximately 3.6 Mbits of on-chip RAM reduces reliance on external memory for many workloads.
• Robust I/O in a compact package: 176 I/Os in a 484-BFBGA (19×19) footprint balances connectivity with board-area efficiency.
• Low-voltage core operation: 0.970 V to 1.080 V supply range supports designs that target reduced core power domains.
• Extended grade and RoHS compliance: Extended temperature rating plus RoHS compliance support regulated manufacturing and thermal requirements.

Why Choose MPF050T-1FCVG484E?

The MPF050T-1FCVG484E is positioned for designs that require very high logic density combined with meaningful on-chip memory and a substantial I/O complement in a compact surface-mount BFBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for a range of commercial and industrial embedded applications that fall within the stated thermal limits.

Choose this part when your design demands large programmable fabric, integrated memory resources, and a high pin-count interface in a package optimized for automated assembly and compact system layouts.

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