MPF050T-FCSG325I

The MPF050T-FCSG325I is a Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade applications. It provides a very large logic fabric with 3,774,874 logic elements and approximately 3.6 Mbits of embedded RAM for on-chip data and buffering needs.

This device combines high logic capacity, a compact 325-TFBGA (325-BGA, 11×11) package and low-voltage core operation (970 mV to 1.08 V), while supporting 164 I/O pins and an operating temperature range of −40 °C to 100 °C for robust deployment in temperature-challenging environments.

Key Features

• Core Logic High-density logic fabric with 3,774,874 logic elements to implement large, complex designs.
• Embedded Memory Approximately 3.6 Mbits of on-chip RAM for data storage, buffering and state retention within the FPGA.
• I/O and Package 164 user I/O pins in a compact 325-TFBGA package (supplier device package: 325-BGA, 11×11) suitable for surface-mount PCB assembly.
• Low-Voltage Core Core supply range from 970 mV to 1.08 V to match low-voltage system architectures and power domains.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Mounting and Compliance Surface-mount TFBGA package and RoHS compliant for streamlined manufacturing and regulatory alignment.

Unique Advantages

• Exceptional logic capacity: 3,774,874 logic elements enable implementation of large-scale digital functions and complex processing pipelines without external logic.
• On-chip memory integration: Approximately 3.6 Mbits of embedded RAM reduces the need for external memory components, simplifying BOM and board layout.
• Compact footprint: 325-TFBGA (11×11) package delivers high integration density in a space-efficient form factor for constrained PCBs.
• Low-voltage operation: Core supply between 970 mV and 1.08 V supports modern low-power system designs and voltage domains.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
• Manufacturing readiness: Surface-mount BGA packaging and RoHS compliance streamline assembly and environmental requirements.

Why Choose MPF050T-FCSG325I?

The MPF050T-FCSG325I is positioned for designs that require very high logic density and substantial on-chip memory within a compact, industrial-rated package. Its combination of nearly 3.8 million logic elements, approximately 3.6 Mbits of embedded RAM, and a 164-pin I/O interface provides a highly integrated platform for complex FPGA implementations.

Engineers and procurement teams seeking a surface-mount FPGA with low-voltage core operation and an extended −40 °C to 100 °C operating range will find this Microchip device suitable for demanding industrial applications where integration density, thermal resilience, and regulatory compliance are important.

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