MPF050T-FCVG484E

The MPF050T-FCVG484E is a high-capacity Field Programmable Gate Array (FPGA) IC designed for designs requiring very large programmable logic, significant embedded memory, and substantial I/O. It delivers millions of logic elements alongside megabits of on-chip RAM in a compact 484-ball BFBGA package for surface-mount assembly.

Targeted at projects that demand dense logic integration and high I/O counts, this extended-grade device supports a low-voltage core supply and an operating range suitable for many standard commercial deployments.

Key Features

• Core Logic — 3,774,874 logic elements provide extensive programmable logic capacity for large-scale designs and complex custom hardware implementations.
• Embedded Memory — Approximately 3.6 Mbits of on-chip RAM to support buffering, state machines, and data storage without immediate external memory dependence.
• I/O Density — 176 user I/O pins to accommodate multiple interfaces and parallel connections in space-constrained systems.
• Power — Core supply range from 970 mV to 1.08 V to match low-voltage system architectures and aid in power budgeting.
• Package & Mounting — 484-BFBGA package (supplier device package: 484-FBGA (19×19)) with surface-mount mounting for compact board integration.
• Grade & Temperature — Extended grade with an operating temperature range of 0 °C to 100 °C for reliable operation across typical commercial deployment conditions.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the device’s large logic element count and on-chip memory to implement complex digital processing and custom logic pipelines.
• Multi-interface hubs — Leverage 176 I/O pins to aggregate and route signals between multiple subsystems or peripherals.
• Embedded systems — Implement system control, data handling, and custom accelerators where on-chip RAM and logic density reduce external component needs.
• Prototyping and custom hardware — Deploy for FPGA-based prototyping of large designs that require high logic capacity and flexible I/O mapping.

Unique Advantages

• High logic capacity: 3,774,874 logic elements enable implementation of large or multiple concurrent functions on a single device, reducing board-level complexity.
• Significant embedded memory: Approximately 3.6 Mbits of on-chip RAM help minimize reliance on external memory for many buffering and storage needs.
• Substantial I/O count: 176 I/O pins support complex interfacing and higher system integration density without additional interface chips.
• Compact BFBGA package: 484-ball BFBGA (19×19) provides a high-pin-count solution in a compact footprint suitable for space-constrained PCBs.
• Low-voltage core support: Core supply range of 970 mV to 1.08 V aligns with modern low-voltage system designs for power-conscious integration.
• Extended grade and RoHS compliance: Extended grade rating and RoHS compliance support deployments requiring broader operating conditions and regulatory alignment.

Why Choose MPF050T-FCVG484E?

The MPF050T-FCVG484E is positioned for designs that need very large programmable logic capacity combined with meaningful on-chip memory and a high I/O count in a compact surface-mount BFBGA package. Its low-voltage core operation and extended-grade temperature range make it suitable for a wide range of commercial embedded applications where integration density and component count reduction are priorities.

This FPGA is a practical choice for engineering teams building large custom logic blocks, consolidating multiple functions onto a single device, or prototyping complex systems that will scale over time.

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