MPF050TL-FCSG325I

The MPF050TL-FCSG325I is a Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 325‑TFBGA surface‑mount package. Designed and specified for industrial applications, the device provides a large logic fabric and embedded memory to implement complex, high‑density digital functions.

Core device characteristics include 3,774,874 logic elements, approximately 3.6 Mbits of embedded RAM, and 164 user I/O pins, making it suitable for industrial embedded systems that require substantial on‑chip logic and memory resources while operating across extended industrial temperature ranges.

Key Features

• Large logic capacity — 3,774,874 logic elements for high‑density logic implementation and complex FPGA designs.
• Embedded memory — Approximately 3.6 Mbits of on‑chip RAM to support buffering, state storage, and data processing without external memory for many use cases.
• I/O connectivity — 164 user I/O pins to interface with peripherals, sensors, and external logic.
• Industrial temperature rating — Specified operating temperature range from –40 °C to 100 °C for deployment in industrial environments.
• Power characteristics — Core voltage supply specified from 970 mV to 1.08 V to meet system power design requirements.
• Compact package — 325‑TFBGA / 325‑BGA (11×11) supplier package in a surface‑mount form factor to minimize PCB footprint.
• Standards and compliance — RoHS‑compliant construction to meet environmental and assembly requirements.
• Microchip PolarFire family support — Device documentation and design flow reference the PolarFire series and associated toolchain guidance (for timing closure, SmartTime is referenced in the datasheet).

Typical Applications

• Industrial control — Implement complex control logic and interfacing using the large logic element count and abundant I/O within an industrial temperature window.
• High‑density signal processing — Leverage the substantial logic resources and approximately 3.6 Mbits of embedded RAM for buffering and pipeline stages in digital signal workflows.
• Custom protocol bridging — Use the 164 I/O pins and programmable fabric to implement protocol conversion, interface aggregation, or bespoke I/O functions.
• Embedded system offload — Partition compute‑intensive or timing‑sensitive tasks into the FPGA fabric to reduce load on host processors while keeping designs compact with the 325‑TFBGA package.

Unique Advantages

• High logic density: 3,774,874 logic elements enable implementation of large, integrated digital functions without partitioning across multiple devices.
• On‑chip memory: Approximately 3.6 Mbits of embedded RAM reduces dependency on external memory for many applications, simplifying BOM and PCB layout.
• Industrial readiness: Specified for operation from –40 °C to 100 °C and marked as Industrial grade, supporting deployment in demanding environments.
• Compact, manufacturable package: 325‑TFBGA surface‑mount package in a 325‑BGA (11×11) footprint balances high pin count with a small PCB area.
• predictable core power: Defined Vcore range (970 mV to 1.08 V) helps streamline power‑supply design and margining.
• RoHS compliant: Supports environmental and regulatory requirements for lead‑free assembly and global manufacturing.

Why Choose MPF050TL-FCSG325I?

The MPF050TL-FCSG325I positions itself as a high‑capacity PolarFire FPGA option tailored for industrial embedded designs that need significant programmable logic, on‑chip memory, and flexible I/O in a compact BGA package. Its industrial temperature rating, RoHS compliance, and clearly defined power and package characteristics make it a practical choice where robustness and long‑term manufacturability matter.

Engineers benefit from Microchip’s PolarFire documentation and referenced design tools for timing closure and design verification, enabling efficient integration into complex systems. This device is well suited to teams seeking to consolidate functionality into a single programmable device while maintaining clear device power and environmental specifications.

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