MPF050TL-FCVG484E

The MPF050TL-FCVG484E is a field programmable gate array (FPGA) designed to deliver high logic density and significant on-chip memory in a compact BFBGA package. With 3,774,874 logic elements, approximately 3.6 Mbits of embedded RAM and 176 I/O, this device addresses designs that require extensive programmable fabric, local data storage and a large number of signal interfaces.

Specified for surface-mount applications, the device operates from a core supply range of 0.97 V to 1.08 V and is graded for an operating temperature range of 0 °C to 100 °C. The part is RoHS compliant and supplied in a 484‑BFBGA package (supplier package: 484‑FBGA, 19×19).

Key Features

• Core Logic  3,774,874 logic elements provide a large programmable fabric for complex digital implementations.
• Embedded Memory  Approximately 3.6 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O  176 configurable I/O pins to accommodate multiple interfaces and peripheral connections.
• Power  Core supply voltage range of 0.97–1.08 V for low-voltage system designs.
• Package & Mounting  484‑BFBGA package (supplier device package: 484‑FBGA, 19×19); surface-mount mounting for compact board integration.
• Operating Grade & Temperature  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-density digital systems  Use the large logic fabric and embedded RAM to implement complex logic, state machines and data-path processing on a single device.
• I/O aggregation and protocol bridging  176 I/O pins enable consolidation of multiple interfaces and signal domains into a single programmable device.
• Space-constrained board designs  The 484‑BFBGA surface-mount package supports dense PCB layouts where board area is limited.

Unique Advantages

• High logic capacity: 3,774,874 logic elements allow implementation of large-scale programmable functions without external logic.
• Substantial on-chip memory: Approximately 3.6 Mbits of embedded RAM reduces reliance on external memory for many data buffering and storage tasks.
• Extensive I/O count: 176 I/O simplifies integration of sensors, peripherals and multiple interfaces.
• Low-voltage core operation: 0.97–1.08 V supply range supports modern low-voltage system architectures.
• Compact BFBGA footprint: 484‑BFBGA (484‑FBGA, 19×19) surface-mount package supports dense, high-performance board designs.
• Extended temperature and regulatory compliance: 0 °C to 100 °C operating range combined with RoHS compliance for broad deployment environments.

Why Choose MPF050TL-FCVG484E?

The MPF050TL-FCVG484E positions itself for designs that demand very high logic density, meaningful on-chip memory and a large number of I/O in a compact, surface-mount package. Its low-voltage core supply and extended operating temperature range make it suitable for a wide range of embedded systems where integration density and board-space efficiency are priorities.

For engineering teams and procurement specialists seeking a RoHS-compliant FPGA solution with substantial programmable resources and flexible I/O, this part provides a balance of capacity, package density and operating specifications to support complex digital designs.

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