MPF050TS-1FCSG325I

The MPF050TS-1FCSG325I is a PolarFire field programmable gate array (FPGA) from Microchip Technology designed for industrial-grade applications. It provides a high-density logic fabric and embedded memory in a compact 325-TFBGA surface-mount package, suited to compute, control and communications tasks where deterministic behavior and scalable logic are required.

Key value propositions include a large count of logic elements, substantial on-chip RAM, a 164-pin I/O footprint, and operation across an industrial temperature range, enabling robust deployment in factory, communications and instrumentation environments.

Key Features

• Logic Fabric — 48,000 configurable logic blocks (CLBs) delivering 3,774,874 logic elements for complex, parallelizable designs.
• Embedded Memory — Approximately 3.6 Mbits of on-chip RAM to support buffers, FIFOs and acceleration functions without external memory.
• I/O Density — 164 user I/Os in a compact 325-BGA (11×11) package, enabling flexible peripheral and system interfacing.
• Low-Voltage Core — Core supply range from 0.970 V to 1.08 V to match low-voltage system power rails.
• Industrial Temperature Rating — Rated for operation from –40 °C to 100 °C for industrial environments; programming functions are supported across the industrial temperature range as described in PolarFire documentation.
• Package & Mounting — 325-TFBGA package, surface-mount mounting type for high-density PCB assembly.
• Standards & Documentation — RoHS-compliant part backed by PolarFire family documentation and toolchain guidance referenced in the product datasheet, including timing closure and power estimation resources.

Typical Applications

• Industrial Automation — Deterministic control, sensor aggregation and real-time I/O processing where industrial temperature operation and high logic density are required.
• Networking and Communications — Packet processing, protocol bridging and line-rate data handling leveraging high logic capacity and on-chip memory; supported by PolarFire documentation addressing Ethernet and transceiver use cases.
• Compute Acceleration — Hardware offload for custom algorithms and streaming data handling using extensive logic resources and embedded RAM.
• Data Acquisition and Instrumentation — Multi-channel signal conditioning, preprocessing and aggregation with flexible I/O and compact package footprint.

Unique Advantages

• Highly Scalable Logic Capacity: Millions of logic elements (3,774,874) enable large, integration-rich designs without partitioning across multiple devices.
• Integrated Memory Resources: Approximately 3.6 Mbits of embedded RAM reduce dependence on external memory and simplify BOM and board layout.
• Compact, High-Density Package: 325-TFBGA (325-BGA, 11×11) provides 164 I/Os in a small footprint for space-constrained PCBs.
• Industrial Reliability: Specified for –40 °C to 100 °C operation and RoHS compliance for long-term deployment in industrial systems.
• Low-Voltage Operation: Core supply range of 0.970 V to 1.08 V supports modern low-power system rail strategies.
• Documented Design Flow: Supported by PolarFire family datasheets and design guides referenced in product documentation for timing closure, power estimation and implementation best practices.

Why Choose MPF050TS-1FCSG325I?

The MPF050TS-1FCSG325I positions itself as a robust, high-capacity FPGA option for engineers building industrial controllers, communication equipment and hardware accelerators. Its combination of tens of thousands of CLBs, millions of logic elements and several megabits of embedded RAM provides the integration density needed to consolidate functions and reduce system complexity.

With industrial temperature support, a compact 325-TFBGA package and design resources in the PolarFire documentation set, this device targets teams that need a scalable, manufacturable FPGA solution backed by Microchip’s PolarFire family materials and tools.

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