MPF050TS-FCVG484I

The MPF050TS-FCVG484I is a Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for high-density digital designs. It delivers extensive logic capacity and on-chip memory for complex programmable logic, with a large complement of I/O and a compact BFBGA package suitable for surface-mount assembly.

This device is positioned for industrial applications requiring substantial programmable logic, many external interfaces, and operation across an extended temperature range. Key attributes include millions of logic elements, several megabits of embedded RAM, low-voltage core operation, and a 484-ball FBGA package.

Key Features

• Logic Capacity — Provides 3,774,874 logic elements (logic cells) to support large-scale programmable designs and complex logic functions.
• Logic Fabric Scale — Includes 48,000 logic clusters as specified for partitioned design and resource planning.
• Embedded Memory — Approximately 3.6 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing.
• I/O Resources — 176 I/O pins to support a wide range of external interfaces and board-level connectivity.
• Power — Core voltage supply range from 970 mV to 1.08 V to match low-voltage system architectures.
• Package & Mounting — 484-ball BFBGA package (supplier package: 484-FBGA, 19×19) in a surface-mount form factor for high-density PCB layouts.
• Temperature Range — Industrial-grade operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Compliance — RoHS compliant to meet common environmental and procurement requirements.

Typical Applications

• Industrial Control Systems — Use the FPGA’s large logic capacity and industrial temperature rating for PLCs, motion control, and factory automation functions.
• High-Density Digital Processing — Implement complex finite state machines, data path logic, and custom compute functions that require millions of logic elements and embedded RAM.
• I/O-Intensive Interface Bridging — Leverage 176 I/Os for protocol conversion, multi-channel interfacing, and board-level signal aggregation.
• Embedded System Integration — Integrate large programmable subsystems in a single BFBGA package while maintaining surface-mount PCB assembly workflows.

Unique Advantages

• Massive Logic Scale: 3,774,874 logic elements enable consolidation of large or multiple functions into a single device, reducing board-level partitioning.
• Significant On-Chip Memory: Approximately 3.6 Mbits of embedded RAM supports buffering, look-up tables, and state storage without external memory in many designs.
• High I/O Count: 176 I/O pins offer flexibility for parallel interfaces, sensors, and multi-protocol designs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in extended-temperature environments common to industrial applications.
• Compact, High-Density Packaging: 484-ball BFBGA (484-FBGA, 19×19) supports dense routing and modern PCB assembly practices.
• RoHS Compliant: Meets environmental compliance expectations for many procurement channels.

Why Choose MPF050TS-FCVG484I?

The MPF050TS-FCVG484I provides a high-capacity FPGA solution for engineering teams that need extensive programmable logic, substantial embedded memory, and a large number of external I/Os in a compact BFBGA package. Its low-voltage core operation and industrial temperature rating make it suitable for demanding designs where integration and robustness are priorities.

This device is well suited to customers designing industrial control, high-density digital processing, or I/O-rich embedded systems that require consolidation of functionality into a single, surface-mount FPGA package from Microchip Technology.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the MPF050TS-FCVG484I.