MPF100T-1FCSG325E

The MPF100T-1FCSG325E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers high logic density with 109,000 logic elements and approximately 7.78 Mbits of embedded memory in a 325‑LFBGA (325‑FCBGA) surface‑mount package.

Designed for applications that require substantial on‑chip logic and memory resources, the device combines a large I/O count with low core supply voltage and an extended temperature grade to meet demanding board‑level integration needs.

Key Features

• Logic Capacity — 109,000 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 7.78 Mbits of on‑chip RAM to support buffering, data processing, and state storage.
• I/O — 170 user I/O pins to support diverse peripheral and interface requirements.
• Power — Core supply range from 970 mV to 1.08 V, enabling low‑voltage operation consistent with modern FPGA power domains.
• Package & Mounting — 325‑FCBGA (11×11) surface‑mount package in a 325‑LFBGA footprint for compact board integration.
• Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for reliable operation in elevated ambient conditions.
• Environmental Compliance — RoHS compliant, meeting common lead‑free requirements for electronic assemblies.

Typical Applications

• High‑density programmable logic — Use where large logic capacity (109,000 logic elements) is required for custom digital functions and acceleration.
• Memory‑intensive processing — Suitable for designs that need approximately 7.78 Mbits of embedded RAM for buffering, packet handling, or streaming data.
• Multi‑I/O interfaces — Ideal for board designs requiring up to 170 I/O signals for peripheral bridging and interface aggregation.
• Space‑constrained PCBs — 325‑FCBGA (11×11) surface‑mount package enables compact placement while supporting high pin count.
• Low‑voltage systems — Designed for integration into systems using a core supply in the 0.97 V to 1.08 V range.

Unique Advantages

• Substantial on‑chip logic: 109,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Significant embedded memory: Approximately 7.78 Mbits of RAM supports larger datasets and local buffering without external memory.
• High I/O count: 170 I/O pins enable flexible connectivity and simplify board-level interface routing.
• Compact, board‑friendly package: 325‑FCBGA (11×11) surface‑mount package balances pin density with a manageable PCB footprint.
• Extended operating range: 0 °C to 100 °C grade provides headroom for designs operating at elevated ambient temperatures.
• Regulatory readiness: RoHS compliance supports lead‑free assembly and common environmental requirements.

Why Choose MPF100T-1FCSG325E?

The MPF100T-1FCSG325E positions itself as a high‑capacity PolarFire FPGA option from Microchip Technology, combining substantial logic and embedded memory with a high I/O count and a compact 325‑FCBGA package. Its low core voltage and extended temperature grade make it suitable for designs that must balance density, power, and thermal requirements.

This device is well suited to engineers and teams needing a single‑chip programmable solution that consolidates logic, memory, and I/O while meeting RoHS requirements. Its specification set supports scalable designs that demand sizable on‑chip resources and compact board integration.

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