MPF100T-1FCSG325I

The MPF100T-1FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC in a 325-LFBGA (325-FCBGA, 11×11) surface-mount package. It provides a high-density FPGA fabric with significant on-chip RAM and a large I/O count targeted at industrial-grade embedded designs.

With 27,250 CLBs, 109,000 logic elements and approximately 7.78 Mbits of embedded memory, this device delivers the capacity needed for complex logic integration while supporting industrial temperature operation and low-voltage core supply.

Key Features

• Logic Fabric — 27,250 CLBs and 109,000 logic elements provide a substantial programmable logic resource for implementing custom digital functions and accelerators.
• Embedded Memory — Approximately 7.78 Mbits of on-chip RAM for buffering, look-up tables, and state storage within the FPGA fabric.
• I/O Capability — 170 user I/Os to support wide-ranging peripheral interfaces and board-level connectivity requirements.
• Power and Voltage — Core supply range from 0.970 V to 1.08 V to match system power-rail planning and low-voltage designs.
• Package and Mounting — 325-LFBGA (325-FCBGA, 11×11) surface-mount package for compact board integration and reliable solder mounting.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Compliance — RoHS compliant, supporting regulatory-driven material requirements.

Typical Applications

• Industrial Control Systems — Use the FPGA fabric and wide I/O set for real-time control, sensor interfacing, and custom logic in industrial equipment operating across a broad temperature range.
• Embedded Processing — Implement custom accelerators, protocol handling, and signal processing using the device’s logic resources and embedded memory.
• I/O-Intensive Designs — Leverage 170 I/Os to aggregate and manage multiple peripherals, buses, and interfaces on a single device.
• Prototyping and Platform Development — Integrate significant logic and memory capacity in a compact FCBGA package for development and evaluation of complex digital systems.

Unique Advantages

• High Logic Density: 109,000 logic elements and 27,250 CLBs enable implementation of large, complex logic blocks without external PLD count increases.
• Substantial On-Chip Memory: Approximately 7.78 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Extensive I/O: 170 user I/Os provide flexibility to connect sensors, interfaces, and peripherals directly to the FPGA fabric.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust 325-FCBGA package suitable for industrial applications.
• Low-Voltage Core: Core supply range of 0.970 V to 1.08 V supports low-voltage system designs and careful power budgeting.
• RoHS Compliant: Meets material compliance requirements for regulated manufacturing environments.

Why Choose MPF100T-1FCSG325I?

The MPF100T-1FCSG325I combines a high-density PolarFire FPGA fabric with substantial embedded memory and a broad I/O set in a compact 325-FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and industrial applications that require reliable programmable logic and on-chip resources.

This device is well suited to designers who need to integrate complex logic, interface many peripherals, and operate across a wide temperature range while maintaining a compact board footprint and low-voltage core operation.

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