MPF050TS-1FCVG484I

The MPF050TS-1FCVG484I is a Field Programmable Gate Array (FPGA) IC supplied in a 484-BFBGA package designed for surface-mount applications. It combines a very large logic capacity with embedded RAM and a defined I/O count, packaged for industrial-grade deployments.

This device operates from a core supply range of 970 mV to 1.08 V and supports an operating temperature range of −40 °C to 100 °C, with RoHS compliance for environmental requirements.

Key Features

• Logic Capacity  Provides 3,774,874 logic elements to support high-density programmable logic designs and complex custom logic implementations.
• Logic Blocks  Includes 48,000 logic blocks to organize and structure large-scale designs (as specified).
• Embedded Memory  Approximately 3.6 Mbits of embedded memory for on-chip storage of buffers, FIFOs, and data structures.
• I/O Count  176 user I/O pins to interface with external peripherals, sensors, and supporting ICs.
• Package  484-BFBGA package (supplier device package: 484-FBGA, 19×19) optimized for high-density PCB routing and thermal performance in a compact footprint.
• Power  Core voltage range of 0.97 V to 1.08 V enables precision power budgeting for core logic domains.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in thermally demanding environments.
• Mounting & Compliance  Surface-mount device with RoHS compliance for lead-free manufacturing processes.

Typical Applications

• High-density logic implementations  Large-scale programmable designs that require millions of logic elements for complex algorithms and custom datapaths.
• Memory-intensive on-chip functions  Designs that need substantial embedded RAM (approximately 3.6 Mbits) for buffering, packet queues, or local data storage.
• I/O-rich interfaces  Systems that require up to 176 I/O connections for sensors, transceivers, and peripheral control.
• Industrial equipment  Industrial-grade deployments where operation from −40 °C to 100 °C and RoHS compliance are required.

Unique Advantages

• Extremely large logic resource: 3,774,874 logic elements enable implementation of very large and complex designs without external logic partitioning.
• Significant on-chip memory: Approximately 3.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Broad I/O availability: 176 I/O pins provide flexible interfacing options for multi-channel systems and mixed-signal front ends.
• Industrial temperature support: Rated for −40 °C to 100 °C to support deployments in demanding thermal environments.
• Compact BGA footprint: 484-BFBGA (484-FBGA, 19×19) package enables high-density PCB layouts while supporting surface-mount assembly processes.
• RoHS compliant: Meets environmental and manufacturing requirements for lead-free assembly.

Why Choose MPF050TS-1FCVG484I?

The MPF050TS-1FCVG484I positions itself as an industrial-grade FPGA option for designers needing a very high logic count, substantial embedded memory, and a broad I/O complement in a compact BGA package. Its defined core voltage range and wide operating temperature make it suitable for controlled-power, thermally diverse deployments.

This device is well suited for teams building large, integrated programmable logic solutions who value on-chip memory capacity, high pin count, and RoHS-compliant, surface-mount packaging for production designs.

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